The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 09, 2018

Filed:

Aug. 01, 2017
Applicant:

Siliconware Precision Industries Co., Ltd., Taichung, TW;

Inventors:

Ching-Wen Chiang, Taichung, TW;

Hsin-Chih Wang, Taichung, TW;

Chih-Yuan Shih, Taichung, TW;

Shih-Ching Chen, Taichung, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 21/56 (2006.01); H01L 21/306 (2006.01); H01L 21/304 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49827 (2013.01); H01L 21/304 (2013.01); H01L 21/306 (2013.01); H01L 21/486 (2013.01); H01L 21/563 (2013.01); H01L 23/49811 (2013.01); H01L 23/49833 (2013.01);
Abstract

A substrate structure is provided, which includes: a substrate body having a first surface and a second surface opposite to the first surface; and a plurality of conductive posts disposed on the first surface of the substrate body and electrically connected to the substrate body. By replacing conventional through silicon vias (TSVs) with the conductive posts, the present disclosure greatly reduces the fabrication cost. The present disclosure further provides an electronic package having the substrate structure and a method for fabricating the electronic package.


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