Hsin-Chih Wang

Title: Hsin-Chih Wang: Innovator in Electronic Packaging

Introduction

Hsin-Chih Wang is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of electronic packaging, holding a total of 2 patents. His innovative approaches have led to advancements that enhance the efficiency and cost-effectiveness of electronic components.

Latest Patents

Wang's latest patents focus on a method for fabricating electronic packages. One of his notable inventions involves a substrate structure that includes a substrate body with a first and a second surface. A plurality of conductive posts is disposed on the first surface, which are electrically connected to the substrate body. By replacing conventional through silicon vias (TSVs) with these conductive posts, Wang's method significantly reduces fabrication costs. This innovation not only provides a new substrate structure but also offers a comprehensive method for fabricating electronic packages.

Career Highlights

Hsin-Chih Wang is currently employed at Siliconware Precision Industries Co., Ltd. His work at this leading company in the semiconductor industry has allowed him to develop and refine his innovative ideas in electronic packaging. His contributions have been instrumental in advancing the technology used in electronic devices.

Collaborations

Wang has collaborated with several talented individuals in his field, including Ching-Wen Chiang and Chih-Yuan Shih. These collaborations have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Hsin-Chih Wang is a key figure in the realm of electronic packaging innovation. His patents and collaborative efforts continue to shape the future of the industry, making significant strides in reducing costs and improving efficiency.