The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 14, 2018

Filed:

Dec. 30, 2015
Applicant:

Siliconware Precision Industries Co., Ltd., Taichung, TW;

Inventors:

Ching-Wen Chiang, Taichung, TW;

Kuang-Hsin Chen, Taichung, TW;

Hsien-Wen Chen, Taichung, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 21/683 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49827 (2013.01); H01L 21/486 (2013.01); H01L 21/6835 (2013.01); H01L 21/6836 (2013.01); H01L 23/5384 (2013.01); H01L 21/568 (2013.01); H01L 23/3128 (2013.01); H01L 23/49811 (2013.01); H01L 23/5389 (2013.01); H01L 2221/68331 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/81005 (2013.01); H01L 2924/15311 (2013.01);
Abstract

A substrate structure is provided, which includes: a substrate body having opposite first and second surfaces; a plurality of conductive posts formed on the first surface of the substrate body and electrically connected to the substrate body; and a dielectric layer formed on the first surface of the substrate body for encapsulating the conductive posts, wherein one end surfaces of the conductive posts are exposed from the dielectric layer. Therefore, the present invention replaces the conventional silicon substrate with the dielectric layer so as to eliminate the need to fabricate the conventional TSVs (Through Silicon Vias) and thereby greatly reduce the fabrication cost. The present invention further provides an electronic package having the substrate structure and a fabrication method thereof.


Find Patent Forward Citations

Loading…