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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10236227 B1

PDFFull Text
Date of Patent:
Mar. 19, 2019

Filed:

Dec. 24, 2015

Electronic package and fabrication method thereof

Applicant:

Siliconware Precision Industries Co., Ltd., Taichung, TW;

Inventors:

Lung-Shan Chuang, Taichung, TW;

Ching-Wen Chiang, Taichung, TW;

Tzung-Yen Wu, Taichung, TW;

Chun-Hung Lu, Taichung, TW;

Assignee:

Siliconware Prescision Industries Co., Ltd., Taichung, TW;

Attorneys:

Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.

Peter F. Corless

Steven M. Jensen

Primary Examiner:

Sheila V Clark

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/053 (2006.01); H01L 21/683 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/14 (2006.01);
U.S. Cl.
CPC ...
H01L 23/053 (2013.01); H01L 21/6835 (2013.01); H01L 21/78 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 24/97 (2013.01); H01L 21/4803 (2013.01); H01L 21/486 (2013.01); H01L 23/147 (2013.01); H01L 23/49811 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/81005 (2013.01); H01L 2224/83005 (2013.01); H01L 2224/97 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/167 (2013.01); H01L 2924/16152 (2013.01); H01L 2924/16153 (2013.01); H01L 2924/16251 (2013.01);
Abstract

An electronic package is provided, including a circuit portion, an electronic element disposed on the circuit portion and a lid member disposed on the circuit portion to cover the electronic element. A separation portion is formed between the lid member and the electronic element. The lid member facilitates to prevent warping of the overall package structure. The invention further provides a method for fabricating the electronic package.

Find Patent Forward Citations

Chuang, Lung-Shan. (2019). Electronic package and fabrication method thereof (U.S. Patent No. 10236227). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10236227

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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