Taichung, Taiwan

Chun-Hung Lu

USPTO Granted Patents = 13 

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Location History:

  • Taichung Hsien, TW (2015)
  • Taichung, TW (2013 - 2024)

Company Filing History:


Years Active: 2013-2024

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13 patents (USPTO):Explore Patents

Title: The Innovations of Chun-Hung Lu: A Pioneer in Substrate Fabrication

Introduction

Chun-Hung Lu, based in Taichung, Taiwan, is an accomplished inventor with a notable portfolio of 13 patents. His work primarily focuses on advanced fabrication methods for electronic substrates, contributing significantly to the field of electronic packaging.

Latest Patents

Two of Chun-Hung Lu's latest patents showcase his innovative approach to substrate fabrication. The first patent, "Fabrication method of substrate having electrical interconnection structures," details a method involving the provision of a substrate body with conductive pads and passivation layers. This method prevents undercutting of metal layers during the manufacturing process, ensuring greater integrity of electronic components.

The second patent, "Method for manufacturing electronic package," describes a new technique for manufacturing electronic packages. This method includes the encapsulation of electronic components with a specialized packaging layer, as well as the introduction of a stress-balancing layer to reduce warpage during production. These innovations enhance the reliability and performance of electronic devices.

Career Highlights

Chun-Hung Lu is currently employed at Siliconware Precision Industries Co., Ltd., a leader in the electronic packaging sector. His contributions have not only advanced the technology but have also helped the company maintain its competitive edge in the market.

Collaborations

Throughout his career, Chun-Hung Lu has collaborated with several talented individuals, including peers Po-Yi Wu and Hui-Chuan Lu. These collaborations have facilitated the exchange of ideas and expertise, further enhancing the innovative capabilities of his team.

Conclusion

Chun-Hung Lu's contributions to substrate fabrication and electronic packaging are invaluable. With his impressive array of patents and collaborative efforts, he continues to shape the future of electronic technologies, making a significant impact in his field. His ongoing innovations promise to enhance the performance and reliability of next-generation electronic devices.

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