The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2019
Filed:
Jan. 30, 2015
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Abstract
A method for fabricating a package structure is provided, which includes the steps of: providing a carrier having a recess; disposing an electronic element in the recess of the carrier; forming an insulating layer in the recess to encapsulate the electronic element; forming a circuit structure on the carrier, wherein the circuit structure is electrically connected to the electronic element; forming a plurality of through holes penetrating the carrier; and forming a conductive material in the through holes to form a plurality of conductors, wherein the conductors are electrically connected to the circuit structure. By using the carrier as a substrate body, the present invention avoids warping of the package structure.