IDiyas

For the Inventor, By the Inventor

Taichung, Taiwan

Hsien-Chang Wu

USPTO Granted Patents = 18 

Average Co-Inventor Count = 3.0

ph-index = 5

Forward Citations = 74(Granted Patents)


Location History:

  • Shu-Lin Town, Taipei Hsien, TW (1999)
  • Sinjhuang, TW (2006)
  • Taipei, TW (2018)
  • Taichung, TW (2014 - 2021)

Company Filing History:

goldMedal15 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal3 out of 832,680 
Other
 patents

Years Active: 1999-2021

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18 patents (USPTO):
1. 11127680 - Semiconductor device and manufacturing method thereof (2021-09-21),
2. 10930552 - Method of semiconductor integrated circuit fabrication (2021-02-23),
3. 10453746 - Method of semiconductor integrated circuit fabrication (2019-10-22),
4. 10160174 - Method of manufacturing sports protective equipment, and sport protective equipment manufactured by the same (2018-12-25),
5. 9947583 - Method of semiconductor integrated circuit fabrication (2018-04-17),
6. 9935006 - Trench liner for removing impurities in a non-copper trench (2018-04-03),
7. 9721894 - Semiconductor device and manufacturing method thereof (2017-08-01),
8. 9627256 - Integrated circuit interconnects and methods of making same (2017-04-18),
9. 9589897 - Trench liner for removing impurities in a non-copper trench (2017-03-07),
10. 9570347 - Method of semiconductor integrated circuit fabrication (2017-02-14),
11. 9530737 - Semiconductor device and manufacturing method thereof (2016-12-27),
12. 9484302 - Semiconductor devices and methods of manufacture thereof (2016-11-01),
13. 9054161 - Method of semiconductor integrated circuit fabrication (2015-06-09),
14. 9006095 - Semiconductor devices and methods of manufacture thereof (2015-04-14),
15. 8735280 - Method of semiconductor integrated circuit fabrication (2014-05-27),

Title: The Innovative Journey of Inventor Hsien-Chang Wu

Introduction:

Inventor Hsien-Chang Wu, based in Taichung, Taiwan, is a visionary force in the realm of semiconductor technology. With a staggering 18 patents to his name, Wu's contributions have significantly impacted the field.

Latest Patents:

Among his latest patents is the groundbreaking "Semiconductor Device and Manufacturing Method Thereof," showcasing Wu's expertise in intricate semiconductor processes. Another notable patent is the "Method of Semiconductor Integrated Circuit Fabrication," highlighting his proficiency in cutting-edge IC fabrication techniques.

Career Highlights:

Wu's career is adorned with accomplishments, having worked with prominent companies like Taiwan Semiconductor Manufacturing Company Limited (TSMC). His innovative spirit and meticulous approach have led to numerous advancements in the semiconductor industry.

Collaborations:

Throughout his career, Wu has collaborated with esteemed professionals in the field. Notable coworkers include Hsiang-Huan Lee and Ching-Fu Yeh, who have contributed to the success of various projects alongside Wu.

Conclusion:

In conclusion, Hsien-Chang Wu's passion for innovation, coupled with his relentless pursuit of excellence, continues to inspire the next generation of inventors and shape the future of technology. His groundbreaking patents and collaborative efforts have solidified his position as a trailblazer in the semiconductor industry.

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