Hsinchu, Taiwan

Hoi-Tou Ng


Average Co-Inventor Count = 3.7

ph-index = 3

Forward Citations = 440(Granted Patents)


Company Filing History:


Years Active: 2014-2024

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7 patents (USPTO):Explore Patents

Title: Hoi-Tou Ng: Innovator in Semiconductor Technology

Introduction

Hoi-Tou Ng is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 7 patents. His work focuses on innovative methods for forming interconnect structures, which are crucial for the advancement of semiconductor devices.

Latest Patents

Among his latest patents, Hoi-Tou Ng has developed methods for forming self-aligned interconnect structures. The first patent describes a semiconductor structure that includes a substrate, a first conductive feature embedded in the substrate, a dielectric layer, and a second conductive feature surrounded by the dielectric layer. This innovative design enhances the performance and reliability of semiconductor devices. The second patent outlines a method for forming interconnect structures, which involves depositing a resist layer over a semiconductor structure and utilizing a specific radiation exposure to create a latent pattern. This method is designed to improve the efficiency of semiconductor manufacturing processes.

Career Highlights

Hoi-Tou Ng is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His expertise and innovative approaches have positioned him as a key player in the development of advanced semiconductor technologies.

Collaborations

Throughout his career, Hoi-Tou Ng has collaborated with notable colleagues, including Ru-Gun Liu and Shih-Ming Chang. These collaborations have further enriched his work and contributed to the advancement of semiconductor technology.

Conclusion

Hoi-Tou Ng's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the field. His innovative methods continue to shape the future of semiconductor manufacturing.

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