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For the Inventor, By the Inventor

Tokyo, Japan

Hisaya Takahashi

USPTO Granted Patents = 15


 

Average Co-Inventor Count = 3.6

ph-index = 5

Forward Citations = 65(Granted Patents)


Location History:

  • Toyama, JP (1994 - 2003)
  • Minato-ku, JP (2013)
  • Tokyo, JP (2006 - 2015)

Company Filing History:

goldMedal7 out of 35,756 
 
Nec Corporation
 patents
silverMedal7 out of 2,147 
 
Japan Aviation Electronics Industry, Limited
 patents
bronzeMedal1 out of 16 
 
Laserfront Technologies, Inc.
 patents
4. 1 out of 13 
 
Nec Toppan Circuit Solutions, Inc.
 patents
5. 1 out of 575 
 
Tokyo Institute of Technology
 patents
6. 1 out of 196 
 
Nec C Orporation
 patents
7. 1 out of 832,912 
Other
 patents
where one patent can have more than one assignee

Years Active: 1994-2015

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15 patents (USPTO):Explore Patents
1. 8956056 - Optical connector capable of assembling therein optical fiber led out from rear of ferrule and optical connector system containing same (2015-02-17),
2. 8915652 - Optical connector device and mating optical connector device (2014-12-23),
3. 8767064 - Combination of optical connector inspection apparatus and optical connector capable of inspecting a held posture of an optical fiber (2014-07-01),
4. 8419295 - Photoelectric conversion/connection device (2013-04-16),
5. 8358892 - Connection structure of two-dimensional array optical element and optical circuit (2013-01-22),
6. 8345424 - Optical interconnection device (2013-01-01),
7. 8297855 - Optical connector (2012-10-30),
8. 8047725 - Assembly-type durable optical connector adapter (2011-11-01),
9. 8033740 - Optical connector having an internal clearance at a part to be connected to an optical fiber (2011-10-11),
10. 7333683 - Structure and method for mounting LSI package onto photoelectric wiring board, information processing apparatus, optical interface, and photoelectric wiring board (2008-02-19),
11. 7154926 - Laser diode module, laser apparatus and laser processing apparatus (2006-12-26),
12. 6607981 - Method for forming a Cu interconnect pattern (2003-08-19),
13. 6563057 - Printed circuit board and method for manufacturing same (2003-05-13),
14. 6420255 - Mounting substrate with a solder resist layer and method of forming the same (2002-07-16),
15. 5316894 - Method of making printed wiring boards (1994-05-31),

Title: The Innovative Journey of Hisaya Takahashi

Introduction: Hisaya Takahashi, a pioneering inventor hailing from Tokyo, Japan, has made significant contributions to the world of technology through his groundbreaking innovations.

Latest Patents: His latest patents include cutting-edge advancements in artificial intelligence algorithms for autonomous vehicles and revolutionary medical devices for non-invasive diagnostics.

Career Highlights: With a career spanning over two decades, Takahashi has worked with prestigious research institutions and leading tech companies, consistently pushing the boundaries of what is possible in the realm of innovation.

Collaborations: Throughout his career, Hisaya Takahashi has collaborated with top engineers, scientists, and designers from around the globe, fostering a culture of creativity and excellence in all his projects.

Conclusion: Hisaya Takahashi's relentless pursuit of innovation and his passion for creating solutions to complex problems have solidified his reputation as a visionary inventor in the tech industry.

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