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Nec Toppan Circuit Solutions, Inc.

USPTO Granted Patents = 13

EPO Patents = 1

Forward Citations = 102

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25 inventors (with patents filed for the assignee):

Hideo Kikuchi (6 out of 61 patents)

Hikaru Kouta (2 out of 26 patents)

Hirofumi Nakamura (2 out of 67 patents)

4. Mikio Oda (2 out of 20 patents)

5. Sakae Kitajo (2 out of 29 patents)

6. Yutaka Akimoto (2 out of 4 patents)

7. Yuzo Shimada (2 out of 44 patents)

8. Toshihide Ito (2 out of 3 patents)

9. Sinichi Hotta (2 out of 2 patents)

10. Satoshi Nakamura (2 out of 68 patents)

11. Satoshi Arai (1 out of 134 patents)

12. Hideki Kikuchi (1 out of 8 patents)

13. Kazuhiro Kinoshita (1 out of 2 patents)

14. Katsuhiro Yoshida (1 out of 30 patents)

15. Hisaya Takahashi (1 out of 15 patents)

13 patents: Sort by Forward Citations

1. 7317610 - Sheet-shaped capacitor and method for manufacture thereof (2008-01-08),

2. 7303978 - Board for mounting BGA semiconductor chip thereon, semiconductor device, and methods of fabricating such board and semiconductor device (2007-12-04),

3. 7106426 - Method of inspecting optical waveguide substrate for optical conduction at increased speed and also inspecting optical waveguide substrate for crosstalk (2006-09-12),

4. 6999643 - Method of manufacturing optical waveguide and method of manufacturing opto-electric wiring board (2006-02-14),

5. 6938336 - Methods of manufacturing board having throughholes filled with resin and multi-layered printed wiring board using the board (2005-09-06),

6. 6882544 - Printed circuit board, method for producing same and semiconductor device (2005-04-19),

7. 6791675 - Optical waveguide path, manufacturing method and coupling method of the same, and optical waveguide path coupling structure (2004-09-14),

8. 6717494 - Printed-circuit board, coaxial cable, and electronic device (2004-04-06),

9. 6709803 - Process for producing printed wiring board (2004-03-23),

10. 6608946 - Optical module and method for manufacturing the same (2003-08-19),

11. 6563057 - Printed circuit board and method for manufacturing same (2003-05-13),

12. 6560505 - Automatic parts placement system, method, and medium (2003-05-06),

13. 6502228 - Route determination support device, route determination support method and storage medium storing therein program for executing method thereof, and printed substrate wiring method (2002-12-31),

NEC Toppan Circuit Solutions, Inc. (NEC TCS) is a leading global provider of advanced semiconductor packaging and test solutions. With a strong focus on innovation and customer satisfaction, NEC TCS delivers high-quality, cost-effective solutions to the semiconductor industry. Leveraging cutting-edge technologies and extensive manufacturing capabilities, they offer a wide range of services including advanced packaging, test development and production, and supply chain management. With a commitment to continuous improvement and collaboration, NEC TCS strives to exceed customer expectations and drive the next generation of semiconductor solutions.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

13 Patents

#1,457 in Tokyo

#3,666 in Japan

#43,688 in the World

Nec Toppan Circuit Solutions, Inc.

Forward Citations = 102

25 inventors:

Hideo Kikuchi (6 out of 61 patents)

Hikaru Kouta (2 out of 26 patents)

Hirofumi Nakamura (2 out of 67 patents)

4. Mikio Oda (2 out of 20 patents)

5. Sakae Kitajo (2 out of 29 patents)

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