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Nec Toppan Circuit Solutions, Inc.

USPTO Granted Patents = 13

% Expired Patents = 30.8

EPO Patents = 1

Forward Citations = 103

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25 inventors (with patents filed for the assignee):

Hideo Kikuchi (6 out of 61 patents)

Hikaru Kouta (2 out of 26 patents)

Hirofumi Nakamura (2 out of 67 patents)

4. Mikio Oda (2 out of 20 patents)

5. Sakae Kitajo (2 out of 29 patents)

6. Yutaka Akimoto (2 out of 4 patents)

7. Yuzo Shimada (2 out of 44 patents)

8. Toshihide Ito (2 out of 3 patents)

9. Sinichi Hotta (2 out of 2 patents)

10. Satoshi Nakamura (2 out of 70 patents)

11. Satoshi Arai (1 out of 137 patents)

12. Hideki Kikuchi (1 out of 10 patents)

13. Kazuhiro Kinoshita (1 out of 2 patents)

14. Katsuhiro Yoshida (1 out of 30 patents)

15. Hisaya Takahashi (1 out of 15 patents)

13 patents: Sort by Forward Citations

1. 7317610 - Sheet-shaped capacitor and method for manufacture thereof (2008-01-08),

2. 7303978 - Board for mounting BGA semiconductor chip thereon, semiconductor device, and methods of fabricating such board and semiconductor device (2007-12-04),

3. 7106426 - Method of inspecting optical waveguide substrate for optical conduction at increased speed and also inspecting optical waveguide substrate for crosstalk (2006-09-12),

4. 6999643 - Method of manufacturing optical waveguide and method of manufacturing opto-electric wiring board (2006-02-14),

5. 6938336 - Methods of manufacturing board having throughholes filled with resin and multi-layered printed wiring board using the board (2005-09-06),

6. 6882544 - Printed circuit board, method for producing same and semiconductor device (2005-04-19),

7. 6791675 - Optical waveguide path, manufacturing method and coupling method of the same, and optical waveguide path coupling structure (2004-09-14),

8. 6717494 - Printed-circuit board, coaxial cable, and electronic device (2004-04-06),

9. 6709803 - Process for producing printed wiring board (2004-03-23),

10. 6608946 - Optical module and method for manufacturing the same (2003-08-19),

11. 6563057 - Printed circuit board and method for manufacturing same (2003-05-13),

12. 6560505 - Automatic parts placement system, method, and medium (2003-05-06),

13. 6502228 - Route determination support device, route determination support method and storage medium storing therein program for executing method thereof, and printed substrate wiring method (2002-12-31),

Company Overview

Nec Toppan Circuit Solutions, Inc. is a prominent player in the field of electronic circuit solutions, specializing in the development and manufacturing of advanced printed circuit boards (PCBs) and related technologies. The company focuses on delivering high-quality, innovative solutions that cater to various industries, including telecommunications, automotive, and consumer electronics. With its headquarters in Tokyo, Japan, Nec Toppan Circuit Solutions leverages cutting-edge research and technology to meet the evolving demands of the global market.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

13 Patents

#1,663 in Tokyo

#3,752 in Japan

#45,081 in the World

Nec Toppan Circuit Solutions, Inc.

Forward Citations = 103

25 inventors:

Hideo Kikuchi (6 out of 61 patents)

Hikaru Kouta (2 out of 26 patents)

Hirofumi Nakamura (2 out of 67 patents)

4. Mikio Oda (2 out of 20 patents)

5. Sakae Kitajo (2 out of 29 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Nec Toppan Circuit Solutions, Inc.. Retrieved from https://idiyas.com/company/nec-toppan-circuit-solutions

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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