The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2005
Filed:
Oct. 18, 2002
Toshihide Ito, Toyama, JP;
Satoshi Nakamura, Tokyo, JP;
Toshihide Ito, Toyama, JP;
Satoshi Nakamura, Tokyo, JP;
NEC Toppan Circuit Solutions, Inc., Tokyo, JP;
Abstract
A resin filled board is manufactured by forming roughened surfaces on a conductive layer in a throughhole before it is filled with a resin, forming smooth surfaces on conductive layers on the top and bottom of the board, printing the resin using a mask having an opening at a position corresponding to the throughhole to selectively fill the resin in the throughhole, and curing the resin. In this way, the surface of the conductive layer around the throughhole is smoothed, so that hardly any of the resin remains on the surfaces near the throughhole when the surfaces of the board is mechanically polished after the resin is cured. Also, the filling resin will not fall down into the throughhole.