The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 19, 2005
Filed:
Jun. 25, 2003
Hirofumi Nakamura, Tokyo, JP;
Satoshi Arai, Miyagi, JP;
Hirofumi Nakamura, Tokyo, JP;
Satoshi Arai, Miyagi, JP;
NEC Toppan Circuit Solutions, Inc., Tokyo, JP;
NEC Tokin Corporation, Sendai, JP;
Abstract
A thin type printed circuit board with an enclosed capacitor of a large capacitance. The printed circuit board includes metal sheethaving roughed surface presenting micro-irregularities, a dielectric film for capacitorcovering the surface of the metal sheet, and a first electrically conductive layer of electrically conductive resincovering the surface of the dielectric film. A second electrically conductive layeris provided on the surface of the first electrically conductive layer in a region of via for cathode side connection. The metal sheet and the first and second electrically conductive layers are encapsulated by resin. The via for cathode side connection, obtained on boring through the resinuntil reaching the second electrically conductive layer, is coated with an electrode. A via for anode side connectionobtained on boring through the resinis coated with an electrodethat is insulated from the second electrically conductive layerby the resin