The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 2004
Filed:
Feb. 20, 2002
Sinichi Hotta, Toyama, JP;
NEC Toppan Circuit Solutions, Inc., Tokyo, JP;
Abstract
After forming first catalyst cores on the surfaces of adhesive layers of an insulating substrate, a plating resist is patterned. The insulating substrate is treated with an aqueous solution containing an anionic surfactant. Then, the insulating substrate is soaked successively in a palladium—tin mixed colloid catalyst solution and an accelerator solution, whereby second catalyst cores are formed on the surface of the adhesive layer not covered with the plating resist. Thereafter, conductive circuits are formed by electroless copper plating. Due to the anionic surfactant, adsorption of the palladium—tin mixed colloid catalyst to the plating resist is suppressed, and the first catalyst cores promote the formation of second catalyst cores. By setting the concentration of the first catalyst cores to 4×10 atomic mol/cm or less, a fine conductive circuit with a line width/line space of 50 &mgr;m or less having a high electrical insulating property between circuit lines can be formed.