The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 08, 2008

Filed:

Nov. 15, 2005
Applicants:

Hirofumi Nakamura, Tokyo, JP;

Yutaka Akimoto, Tokyo, JP;

Sadamu Toita, Miyagi, JP;

Takayuki Inoi, Miyagi, JP;

Katsuhiro Yoshida, Miyagi, JP;

Inventors:

Hirofumi Nakamura, Tokyo, JP;

Yutaka Akimoto, Tokyo, JP;

Sadamu Toita, Miyagi, JP;

Takayuki Inoi, Miyagi, JP;

Katsuhiro Yoshida, Miyagi, JP;

Assignees:

NEC Toppan Circuit Solutions, Inc., Tokyo, JP;

NEC Tokin Corporation, Sendai-Shi, Miyagi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/228 (2006.01); H01G 9/00 (2006.01); H01G 9/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

A sheet-shaped capacitor for storing electrical charges of large capacities, and to assure facilitated manufacture, cost reduction and improved reliability, and a method for manufacturing the capacitor. The capacitor includes a dielectric film, formed on a first major surface of a metal plate, an electrically conductive high polymer layer, formed on a first major surface of the dielectric film, and an electrically conductive layerformed on a first major surface of the electrically conductive high polymer layer, such as by copper plating. A cathode electrodeis led out from the electrically conductive layeron the side electrically conductive high polymer layer


Find Patent Forward Citations

Loading…