Nec Corporation

Japan Aviation Electronics Industry, Limited

Other

Tokyo Institute of Technology

Nec C Orporation

Laserfront Technologies, Inc.

Nec Toppan Circuit Solutions, Inc.

Hisaya Takahashi

Hideyuki Ono

Mikio Oda

Yuichi Koreeda

Hikaru Kouta

Naoki Katagiyama

Takashi Ohtsuka

Kaichiro Nakano

Keiichi Kubota

Jun Sakai

Junichi Sasaki

Ichiro Hatakeyama

Kazunori Miyoshi

Kohroh Kobayashi

Mitsuru Kurihara

Hiroyuki Honma

Hirofumi Nakamura

Tomotaka Ishida

Arihide Noda

Masanobu Izaki

Junichi Katayama

Kaichirou Nakano

Yuuzou Ikeda

Sinichi Hotta

Kazuhito Asada

Tomohiko Aso

Wataru Ohtsu

Masaki Tunekane

Toshinori Ishida

Toshihide Itoh

An optical connector has a pair of coil springs () which are disposed so as to sandwich an optical fiber () led out of the rear of a ferrule () in substantially the axial direction (A) and which extend in the axial direction (A).

Optical connector capable of assembling therein optical fiber led out from rear of ferrule and optical connector system containing same

Optical connectors can be easily attached to and detached from a housing. An optical connector deviceadapted to be connected to a mating optical connector deviceincludes a first housingfor receiving and holding optical connectors, a second housingfor holding the first housingin a floating manner, and a fixing memberfor fixedly attaching the second housingto an attachment object. To-be-locked portionsof the first housingand locking portionsof the second housingdetachably engage with each other and cause the first housingto engage with the second housingin a floating manner. The to-be-locked portionsand the locking portionsengage with each other in a direction perpendicular to a direction Aof connection to the mating optical connector device

Optical connector device and mating optical connector device

The light source is disposed in a direction traversing the axial direction A of the optical connector. The optical connector holder comprises an inspection light reflecting portion. The inspection light reflecting portion deflects and reflects the inspection light from the light source to the axial direction A so that the inspection light enters the reference hole portion of the optical connector.

Combination of optical connector inspection apparatus and optical connector capable of inspecting a held posture of an optical fiber

In a photoelectric conversion/connection device () including an optical element (), a mounting board () on which the optical element is mounted, and an optical connector () which is connected to the mounting board so as to be optically connected to the optical element, the optical connector () is arranged on a surface () opposite to a mounting surface () of the mounting board () and the optical element () is exposed. The photoelectric conversion/connection device () includes a motherboard () having a main surface () and an electric connector () to be mounted on the main surface of the motherboard. The electric connector () is detachably connected to the mounting board ().

Photoelectric conversion/connection device

Optical elements (light sourcesor photodetectors) are arranged in a two-dimensional array, and the relative positional relationship between the optical elements and optical waveguidesis defined such that optical waveguidesextend between the optical elements in the two-dimensional array substantially parallel to substratefor increased parallelism. Micromirrorsare disposed in respective optical waveguidesto bend light beams through 90 degrees to realize a highly efficient optical coupling between the optical elements and optical waveguides. The optical waveguides are stacked in multiple stages, and light beams are lead to the optical waveguides in the multiple stacks through micromirrorsacross the stacked plane of the optical waveguides, thereby realizing parallel connection between the two-dimensional array of optical elements and a two-dimensional array of optical waveguides. There is thus provided a connection structure between the optical elements and optical waveguides, which is small in size and high in efficiency, and is of high parallelism.

Connection structure of two-dimensional array optical element and optical circuit

Provided is an optical interconnection device in which a volume required for cooling is reduced. In the optical interconnection device, a plurality of optical modules () are arranged on a periphery of an LSI () electrically connected to an electric wiring board (), and liquid cooling mechanisms () are respectively placed on the LSI () and the optical modules (). The plurality of optical modules () may be arranged only on a surface of the electric wiring board () where the LSI () is mounted, only on a surface opposite to the surface where the LSI () is mounted, or on both the same surface as and the opposite surface to the surface where the LSI () is mounted.

Optical interconnection device

An optical connectoris for connecting a connection objectto an optical module. A slideris slidably held by a housingadapted for positioning the connection object and the optical module. The housing has a first positioning portion for receiving the connection object. The slider has a first pressing portionfor elastically pressing the connection object in a first direction toward the first positioning portion and a second pressing portionthat elastically acts in a second direction perpendicular to the first direction.

Optical connector

In an optical connector adapter for use in connecting a first and a second optical connector plug to each other, a second adapter half is butted against a first adapter half in a predetermined direction. The first and second adapter halves have engaging means for maintaining the first and second adapter halves in a butted state in the predetermined direction. The engaging means is configured to be disposed inside the optical connector adapter and to be prevented from releasing engagement thereof by at least one of the first and second optical connector plugs.

Assembly-type durable optical connector adapter

In an optical connector including a base housing, a cover housing, and a clamp fixing the cover housing to the base housing, the base housing is provided with a groove for positioning and holding an optical fiber of an optical cable, a first recessed portion continuously formed from the groove, and a second recessed portion continuously formed from the first recessed portion. The first and the second recessed portions have bottom portions different in level from each other to have a stepped portion formed therebetween. The cover housing has a first coating portion for covering the groove and a second coating portion for covering the first and the second recessed portions. The bottom portion of the second recessed portion and the second coating portion presses a coating member of the optical cable to clamp the optical cable.

Optical connector having an internal clearance at a part to be connected to an optical fiber

An LSI package having an optical interface is mounted on a surface of a photoelectric wiring board. The photoelectric wiring board and the optical interface are optically connected with sufficient precision. A wiring board side guide member including socket pins and guide pins is soldered and fixed onto the photoelectric wiring board including an optical transmission line, a guide pin, and a mirror. An optical interface side guide member having a fitting hole is glued to the optical interface. The optical interface is mounted on an interposer of the LSI package. The guide pin of the photoelectric wiring board is fitted into the fitting hole formed through the interposer. The guide pin of the guide member is fitted into the fitting hole of the guide member. As a result, position alignment between the optical interface and the photoelectric wiring board is conducted with high precision.

Structure and method for mounting LSI package onto photoelectric wiring board, information processing apparatus, optical interface, and photoelectric wiring board

Submount substrates are connected to both sides of a laser diode via hard solders. The lower submount substrate and a heat sink are connected together by a soft solder. The heat sink and a presser electrode are fixed with a predetermined gap therebetween via an insulating spacer. A coil electrode is fitted in a V-shaped groove of the presser electrode. As the coil electrode is deformed slightly elastically, the coil electrode is pressed against the upper submount substrate.

Laser diode module, laser apparatus and laser processing apparatus

A method for forming a Cu interconnect pattern on a ZnO film of a printed circuit board without using a metallic catalyst on the ZnO film includes the steps of replacing Zn in the ZnO film by Cu in an aqueous solution of copper sulfate to form a CuO film, reducing the CuO in the CuO film to Cu in an aqueous solution of hydrogenated boron potassium to form a metallic Cu film, and plating the metallic Cu film with a plating Cu film in a plating liquid. The absence of the metallic catalyst improves the insulation resistance of the Cu interconnect pattern in the printed circuit board.

Method for forming a Cu interconnect pattern

In a multilayer printed circuit board having a conductor pattern, covered with an insulation layer having via holes, these via holes are filled with a conductor by means of electroless nickel plating or electroless copper plating.

Printed circuit board and method for manufacturing same

The present invention provides a substrate structure comprising: a plurality of electrodes provided on a substrate, each of the electrodes comprising an electrode pad on the substrate and a bump on the electrode pad; and a solder resist layer provided over the substrate, so that the solder resist layer extends in gaps between the electrodes and covers the electrode pads and the bumps except for at least top portions of the bumps, whereby top portions of the bumps are positioned higher than a surface of the solder resist layer to have the solder resist layer isolate adjacent two of the electrodes.

Mounting substrate with a solder resist layer and method of forming the same

A method of making a printed wiring board comprises the steps of applying a solder resist onto a printed wiring board on which circuits for junction and pads for surface-mounting are formed, to form a solder resist layer; grinding the surface of the solder resist layer to remove the solder resist present on the circuits and the pads and to expose the surface thereof; applying a light-sensitive liquid solder resist to the surface of the printed wiring board, drying the light-sensitive solder resist layer to form a light-sensitive solder resist film; exposing the light-sensitive solder resist film to light through a mask film carrying a desired pattern; and then dissolving the un-exposed area of the light-sensitive solder resisit film with a developer to remove the same area and to cover the exposed area with the cured solder resist film. The method does not suffer any discrepancy of position of a solder resist film relative to the distributing wire and pad patterns formed on the printed wiring board and peeling off of the solder resist film and the method can ensure high reliability of soldering.

Growing community of inventors

Tokyo, Japan

Hisaya Takahashi