The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 19, 2008

Filed:

Oct. 07, 2005
Applicants:

Junichi Sasaki, Tokyo, JP;

Ichiro Hatakeyama, Tokyo, JP;

Kazunori Miyoshi, Tokyo, JP;

Hikaru Kouta, Tokyo, JP;

Kaichiro Nakano, Tokyo, JP;

Mikio Oda, Tokyo, JP;

Hisaya Takahashi, Tokyo, JP;

Mitsuru Kurihara, Tokyo, JP;

Inventors:

Junichi Sasaki, Tokyo, JP;

Ichiro Hatakeyama, Tokyo, JP;

Kazunori Miyoshi, Tokyo, JP;

Hikaru Kouta, Tokyo, JP;

Kaichiro Nakano, Tokyo, JP;

Mikio Oda, Tokyo, JP;

Hisaya Takahashi, Tokyo, JP;

Mitsuru Kurihara, Tokyo, JP;

Assignee:

NEC Corproation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02B 6/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An LSI package having an optical interface is mounted on a surface of a photoelectric wiring board. The photoelectric wiring board and the optical interface are optically connected with sufficient precision. A wiring board side guide member including socket pins and guide pins is soldered and fixed onto the photoelectric wiring board including an optical transmission line, a guide pin, and a mirror. An optical interface side guide member having a fitting hole is glued to the optical interface. The optical interface is mounted on an interposer of the LSI package. The guide pin of the photoelectric wiring board is fitted into the fitting hole formed through the interposer. The guide pin of the guide member is fitted into the fitting hole of the guide member. As a result, position alignment between the optical interface and the photoelectric wiring board is conducted with high precision.


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