The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 26, 2006
Filed:
Sep. 17, 2004
Hikaru Kouta, Tokyo, JP;
Hisaya Takahashi, Tokyo, JP;
Hideyuki Ono, Tokyo, JP;
Yuuzou Ikeda, Tokyo, JP;
Masaki Tunekane, Tokyo, JP;
Toshinori Ishida, Kanagawa, JP;
Keiichi Kubota, Tokyo, JP;
Hikaru Kouta, Tokyo, JP;
Hisaya Takahashi, Tokyo, JP;
Hideyuki Ono, Tokyo, JP;
Yuuzou Ikeda, Tokyo, JP;
Masaki Tunekane, Tokyo, JP;
Toshinori Ishida, Kanagawa, JP;
Keiichi Kubota, Tokyo, JP;
Abstract
Submount substrates are connected to both sides of a laser diode via hard solders. The lower submount substrate and a heat sink are connected together by a soft solder. The heat sink and a presser electrode are fixed with a predetermined gap therebetween via an insulating spacer. A coil electrode is fitted in a V-shaped groove of the presser electrode. As the coil electrode is deformed slightly elastically, the coil electrode is pressed against the upper submount substrate.