The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 01, 2013
Filed:
Feb. 16, 2009
Mikio Oda, Tokyo, JP;
Tomotaka Ishida, Tokyo, JP;
Hisaya Takahashi, Tokyo, JP;
Hideyuki Ono, Tokyo, JP;
Jun Sakai, Tokyo, JP;
Takashi Ohtsuka, Tokyo, JP;
Arihide Noda, Tokyo, JP;
Hikaru Kouta, Tokyo, JP;
Mikio Oda, Tokyo, JP;
Tomotaka Ishida, Tokyo, JP;
Hisaya Takahashi, Tokyo, JP;
Hideyuki Ono, Tokyo, JP;
Jun Sakai, Tokyo, JP;
Takashi Ohtsuka, Tokyo, JP;
Arihide Noda, Tokyo, JP;
Hikaru Kouta, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
Provided is an optical interconnection device in which a volume required for cooling is reduced. In the optical interconnection device, a plurality of optical modules () are arranged on a periphery of an LSI () electrically connected to an electric wiring board (), and liquid cooling mechanisms () are respectively placed on the LSI () and the optical modules (). The plurality of optical modules () may be arranged only on a surface of the electric wiring board () where the LSI () is mounted, only on a surface opposite to the surface where the LSI () is mounted, or on both the same surface as and the opposite surface to the surface where the LSI () is mounted.