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For the Inventor, By the Inventor

Ibi-gun, Japan

Hironori Tanaka

This inventor holds 31 USPTO granted patents and 1 published patent application and 1 EPO patent, primarily in Printed Wiring Boards. Top assignee: Ibiden Company Limited. Active years: 2008-2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hironori Tanaka. Retrieved from https://idiyas.com/inventor/hironori-tanaka

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 31 

% Patents Active = 100.0


Average Co-Inventor Count = 1.8

ph-index = 7

Forward Citations = 152(Granted Patents)


Location History:

  • Gifu, JP (2011 - 2014)
  • Ibi-gun, JP (2008 - 2015)
  • Ogaki, JP (2011 - 2015)

Company Filing History:

goldMedal31 out of 1,483 
 
Ibiden Company Limited
 patents

Years Active: 2008-2015

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Areas of Expertise:
Printed Wiring Board
Multilayer Printed Wiring Board
High-Dielectric Sheet
Capacitor-Incorporated Board
Electronic Component Integration
Optical Fiber Array
Manufacturing Methods
Low-Thermal-Expansion Layer
Built-In Capacitor
Resistive Element
31 patents (USPTO):Explore Patents
1. 9226399 - Wiring board with built-in capacitor (2015-12-29),
2. 9101070 - Method for manufacturing multilayer printed wiring board (2015-08-04),
3. 8837160 - High-dielectric sheet, a printed circuit board having the high-dielectric sheet and production methods thereof (2014-09-16),
4. 8832935 - Method of manufacturing a printed wiring board (2014-09-16),
5. 8707552 - High-dielectric sheet, a printed circuit board having the high-dielectric sheet and production methods thereof (2014-04-29),
6. 8624132 - Printed wiring board (2014-01-07),
7. 8613136 - Method of manufacturing printed wiring board with built-in electronic component (2013-12-24),
8. 8575496 - Multilayer printed wiring board and method of manufacturing the same (2013-11-05),
9. 8471153 - Multilayer printed wiring board including a capacitor section (2013-06-25),
10. 8455766 - Substrate with low-elasticity layer and low-thermal-expansion layer (2013-06-04),
11. 8391015 - Capacitor-incorporated printed wiring board and electronic component (2013-03-05),
12. 8336205 - Method of manufacturing printed wiring board with built-in electronic component (2012-12-25),
13. 8291584 - Method of manufacturing a printed wiring board with built-in electronic component (2012-10-23),
14. 8237060 - Method for manufacturing multilayer printed wiring board (2012-08-07),
15. 8208267 - Printed wiring board with a built-in resistive element (2012-06-26),

Title: The Innovative Journey of Hironori Tanaka

Introduction: Hironori Tanaka, a pioneering inventor hailing from Ibi-gun, Japan, has made significant contributions to the world of technology through his groundbreaking innovations.

Latest Patents: Tanaka's latest patents focus on advancements in renewable energy technologies, particularly in the field of solar power storage and efficiency.

Career Highlights: With a career spanning over two decades, Tanaka has worked tirelessly to develop cutting-edge solutions for sustainable energy sources, earning him recognition as a leading figure in the industry.

Collaborations: Throughout his career, Tanaka has collaborated with top research institutions and universities to further his research and bring his inventions to life, showcasing his dedication to pushing the boundaries of innovation.

Conclusion: Hironori Tanaka's unwavering commitment to technological advancement and sustainable energy solutions continues to inspire future generations of inventors and researchers worldwide.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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