The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 23, 2012
Filed:
May. 21, 2009
Hironori Tanaka, Ogaki, JP;
Hironori Tanaka, Ogaki, JP;
Ibiden Co., Ltd., Ogaki-shi, JP;
Abstract
A method for manufacturing a printed wiring board, including forming an alignment mark in a metal foil, forming a bump on the metal foil at a position determined based on the alignment mark, positioning an electronic component over the metal foil, the positioning comprising aligning a terminal of the electronic component with the bump based on the alignment mark, connecting the terminal of the electronic component with the bump, forming an insulation layer enclosing the electronic component connected with the bump such that the electronic component is placed inside a printed wiring board, and patterning the metal foil to which the electronic component is connected through the bump.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile