The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 16, 2014

Filed:

Jul. 01, 2011
Applicants:

Takashi Kariya, Ibi-gun, JP;

Hironori Tanaka, Ibi-gun, JP;

Inventors:

Takashi Kariya, Ibi-gun, JP;

Hironori Tanaka, Ibi-gun, JP;

Assignee:

Ibiden Co., Ltd., Ogaki-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01); H01L 21/48 (2006.01); H01L 23/50 (2006.01); H01L 23/498 (2006.01); H05K 3/38 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/162 (2013.01); H05K 2201/0179 (2013.01); H05K 2201/09563 (2013.01); H05K 2201/096 (2013.01); H01L 2924/0002 (2013.01); H05K 3/388 (2013.01); H01L 21/4867 (2013.01); H05K 2201/0175 (2013.01); H01L 23/50 (2013.01); H01L 2924/3011 (2013.01); H01L 23/498 (2013.01); H05K 2201/09309 (2013.01); H05K 2201/09536 (2013.01); H05K 3/4602 (2013.01); H05K 2201/0195 (2013.01); H05K 2201/09718 (2013.01);
Abstract

A method of producing a capacitor for a printed circuit board includes producing high-dielectric sheets and selecting ones of the high-dielectric sheets, which are substantially free from a defect after the heat process. Each of the high-dielectric sheets is produced by providing a first electrode, forming a first sputter film on the first electrode, forming an intermediate layer on the first sputter film by calcining a sol-gel film, forming a second sputter film on the intermediate layer, and providing a second electrode on the second sputter film. The high-dielectric sheets are subjected to a heat process in which the high-dielectric sheets are subjected to a first temperature at least once and a second temperature higher than the first temperature at least once.


Find Patent Forward Citations

Kariya, Takashi. (2014). High-dielectric sheet, a printed circuit board having the high-dielectric sheet and production methods thereof (U.S. Patent No. 8837160). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8837160

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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