The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 2012
Filed:
Aug. 12, 2011
Hironori Tanaka, Ogaki, JP;
Kazuhiro Yoshikawa, Ogaki, JP;
Naoaki Fujii, Ogaka, JP;
Atsunari Yamashita, Ogaki, JP;
Hironori Tanaka, Ogaki, JP;
Kazuhiro Yoshikawa, Ogaki, JP;
Naoaki Fujii, Ogaka, JP;
Atsunari Yamashita, Ogaki, JP;
Ibiden Co., Ltd., Ogaki-shi, JP;
Abstract
A printed wiring board is manufactured by a method in which a base substrate having a first insulation layer, a second insulation layer, and a conductive film is provided. An electronic component is placed on the first insulation layer at a position determined based on an alignment mark. After the electronic component is enclosed inside an opening of the second insulation layer, a via hole exposing a terminal of the electronic component is formed at a position determined based on the alignment mark, which is used to determine the position of the electronic component. A via conductor is formed in the via hole, and a conductive layer is formed on the conductive film and patterned to form a conductive circuit connected to the via conductor.