Hiroaki Umeda

Title: Hiroaki Umeda: Innovator in Shield Package Technology

Introduction

Hiroaki Umeda, an accomplished inventor based in Kizugawa, Japan, has made significant contributions to the field of packaging technology. With a total of 14 patents to his name, Umeda is known for his innovative approaches in developing shielding solutions for electronic components.

Latest Patents

Among Umeda's most recent inventions are two notable patents focused on shield packages. The first patent addresses a shield package designed with a highly distinctive patterned portion on the surface of a shield layer. This innovative package encapsulates an electronic component sealed with a unique sealing material, featuring a distinct ratio of autocorrelation lengths between its patterned and non-patterned portions. The second patent expands on this concept by detailing a method of manufacturing a shield package that incorporates a drawing area created by aggregating multiple grooves, resulting in a visually compelling design with multiple depressions that form a distinctive pattern.

Career Highlights

Hiroaki Umeda is currently employed at Tatsuta Electric Wire & Cable Co., Ltd., where he has harnessed his expertise to propel advancements in electronic component packaging. His innovative spirit and dedication to improving technology have established him as a key figure within the industry.

Collaborations

Throughout his career, Umeda has collaborated with notable coworkers, including Kazuhiro Matsuda and Ken Yukawa. These partnerships have played a crucial role in enhancing his research and development initiatives, leading to successful patent applications and innovations in shield packaging.

Conclusion

Hiroaki Umeda’s contributions to the field of shield packages are a testament to his inventive prowess and commitment to technological advancement. With his ongoing research and innovative designs, he continues to influence the industry and inspire other inventors in the realm of electronic component packaging.