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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10259952 B1

PDFFull Text
Date of Patent:
Apr. 16, 2019

Filed:

Sep. 15, 2015

Conductive coating material for shielding electronic component package and method for producing shielded package

Applicant:

Tatsuta Electric Wire & Cable Co., Ltd., Higashiosaka-shi, Osaka, JP;

Inventors:

Hiroaki Umeda, Kizugawa, JP;

Kazuhiro Matsuda, Kizugawa, JP;

Assignee:

Tatsuta Electric Wire & Cable Co., Ltd., Osaka, JP;

Attorney:

Norris McLaughlin, P.A.

Primary Examiner:

Robert B Davis

Int. Cl.
CPC ...
C09D 5/24 (2006.01); C09D 7/40 (2018.01); C08G 59/46 (2006.01); C08G 59/56 (2006.01); H01L 21/56 (2006.01); H01L 23/29 (2006.01); C09D 163/00 (2006.01); H01L 23/00 (2006.01); H01L 23/28 (2006.01); H01L 23/31 (2006.01); C08K 5/07 (2006.01); C08L 33/26 (2006.01); C09D 5/03 (2006.01); H01L 23/552 (2006.01);
U.S. Cl.
CPC ...
C09D 5/24 (2013.01); C08G 59/46 (2013.01); C08G 59/56 (2013.01); C08K 5/07 (2013.01); C08L 33/26 (2013.01); C09D 5/031 (2013.01); C09D 7/40 (2018.01); C09D 163/00 (2013.01); H01L 21/56 (2013.01); H01L 23/00 (2013.01); H01L 23/28 (2013.01); H01L 23/29 (2013.01); H01L 23/295 (2013.01); H01L 23/31 (2013.01); H01L 23/552 (2013.01); H01L 24/97 (2013.01); H01L 2924/3025 (2013.01);
Abstract

Provided herein is a conductive coating material that can be spray coated to form a shielding layer having desirable shielding performance, and desirable adhesion to a package. A shielded package producing method using the conductive coating material is also provided. The conductive coating material comprises at least (A) 100 parts by mass of a binder component containing 5 to 30 parts by mass of a solid epoxy resin that is solid at ordinary temperature, and 20 to 90 parts by mass of a liquid epoxy resin that is liquid at ordinary temperature, (B) 200 to 1800 parts by mass of metallic particles, and (C) 0.3 to 40 parts by mass of a curing agent. The conductive coating material has a viscosity of 3 to 30 dPa·s.

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