The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 18, 2024

Filed:

Nov. 19, 2019
Applicant:

Tatsuta Electric Wire & Cable Co., Ltd., Osaka, JP;

Inventors:

Hiroaki Umeda, Kizugawa, JP;

Hidetoshi Noguchi, Kizugawa, JP;

Hajime Nakazono, Kizugawa, JP;

Sougo Ishioka, Kizugawa, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01); G06K 19/06 (2006.01); H01L 23/552 (2006.01);
U.S. Cl.
CPC ...
H05K 9/003 (2013.01); G06K 19/06037 (2013.01); H01L 23/552 (2013.01); H05K 9/0081 (2013.01); H01L 2223/54413 (2013.01);
Abstract

The present invention aims to provide a shield package having a highly distinctive patterned portion formed on a surface of a shield layer. The shield package of the present invention includes a package in which an electronic component is sealed with a sealing material, and a shield layer covering the package, wherein a surface of the shield layer includes a patterned portion and a non-patterned portion other than the patterned portion, and a ratio of Sal (autocorrelation length) of the non-patterned portion to Sal of the patterned portion is as follows: (Sal of non-patterned portion)/(Sal of patterned portion)>4.0.


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