Kizugawa, Japan

Hajime Nakazono


 

Average Co-Inventor Count = 2.6

ph-index = 1

Forward Citations = 2(Granted Patents)


Location History:

  • Kizugawa, JP (2018 - 2024)
  • Kyoto, JP (2022 - 2024)

Company Filing History:


Years Active: 2018-2024

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6 patents (USPTO):Explore Patents

Title: Hajime Nakazono: Innovator in Shield Packaging Technology

Introduction

Hajime Nakazono is a prominent inventor based in Kizugawa, Japan. He has made significant contributions to the field of electronic packaging, holding a total of six patents. His innovative work focuses on enhancing the functionality and efficiency of shield packages used in electronic components.

Latest Patents

One of Nakazono's latest patents is for a shield package designed to provide a highly distinctive patterned portion on the surface of a shield layer. This invention aims to improve the performance of electronic components by incorporating a unique design that differentiates between patterned and non-patterned areas. The shield package includes a sealing material that encapsulates the electronic component, with a specific ratio of autocorrelation length (Sal) between the patterned and non-patterned portions, ensuring optimal shielding effectiveness. Another notable patent involves an electroconductive coating material that can be cured at low temperatures. This innovative coating material consists of an epoxy resin-containing binder, metal particles, a curing agent, a solvent, and a curing catalyst, making it suitable for various applications in shielded packaging.

Career Highlights

Hajime Nakazono is associated with Tatsuta Electric Wire & Cable Co., Ltd., where he has been instrumental in developing advanced packaging solutions. His work has not only contributed to the company's reputation but has also pushed the boundaries of technology in the electronics industry.

Collaborations

Throughout his career, Nakazono has collaborated with talented individuals such as Hiroaki Umeda and Hidetoshi Noguchi. These partnerships have fostered a creative environment that has led to the development of innovative solutions in electronic packaging.

Conclusion

Hajime Nakazono's contributions to shield packaging technology exemplify his dedication to innovation in the electronics field. His patents reflect a commitment to enhancing the performance and reliability of electronic components. Nakazono's work continues to influence the industry and inspire future advancements.

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