The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 27, 2024
Filed:
Feb. 18, 2019
Applicant:
Tatsuta Electric Wire & Cable Co., Ltd., Osaka, JP;
Inventors:
Hajime Nakazono, Kyoto, JP;
Kazuhiro Matsuda, Kyoto, JP;
Assignee:
Tatsuta Electric Wire & Cable Co., Ltd., Osaka, JP;
Primary Examiner:
Int. Cl.
CPC ...
C09D 5/24 (2006.01); C09D 7/61 (2018.01); C08K 3/08 (2006.01); C08K 5/00 (2006.01); C09D 163/00 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01); H01L 23/552 (2006.01); H01B 1/22 (2006.01); H05K 9/00 (2006.01); C09D 7/20 (2018.01); C08G 59/40 (2006.01); C08K 5/56 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
C09D 5/24 (2013.01); C08G 59/4028 (2013.01); C08K 3/08 (2013.01); C08K 5/0091 (2013.01); C08K 5/56 (2013.01); C09D 7/20 (2018.01); C09D 7/61 (2018.01); C09D 163/00 (2013.01); H01B 1/22 (2013.01); H01L 21/56 (2013.01); H01L 21/78 (2013.01); H01L 23/552 (2013.01); H05K 9/00 (2013.01); H05K 9/0075 (2013.01); C08K 2003/085 (2013.01); C08K 2003/0806 (2013.01); H01L 23/3121 (2013.01);
Abstract
The present invention provides a conductive coating material curable at low temperatures. The present invention relates to a conductive coating material containing: 100 parts by weight of an epoxy resin-containing binder component (A); 500 to 2500 parts by weight of metal particles (B); 1 to 150 parts by weight of a curing agent (C); 20 to 800 parts by weight of a solvent (D); and 0.5 to 5 parts by weight of a curing catalyst (E).