logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11191198 B1

PDFFull Text
Expired
Date of Patent:
Nov. 30, 2021

Filed:

Sep. 27, 2018

Shield package

Applicant:

Tatsuta Electric Wire & Cable Co., Ltd., Higashiosaka, JP;

Inventors:

Hiroaki Umeda, Kizugawa, JP;

Kazuhiro Matsuda, Kizugawa, JP;

Hajime Nakazono, Kizugawa, JP;

Hidetoshi Noguchi, Kizugawa, JP;

Assignee:

TATSUTA ELECTRIC WIRE & CABLE CO., LTD., Higashiosaka, JP;

Attorney:

Westerman, Hattori, Daniels & Adrian, LLP

Primary Examiner:

Tuan T Dinh

Int. Cl.
CPC ...
H05K 9/00 (2006.01); C09D 7/61 (2018.01); C09D 5/24 (2006.01); C09D 163/00 (2006.01); H01L 21/56 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 23/552 (2006.01); H05K 5/06 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0083 (2013.01); C09D 5/24 (2013.01); C09D 7/61 (2018.01); C09D 163/00 (2013.01); H01L 21/561 (2013.01); H01L 23/295 (2013.01); H01L 23/3121 (2013.01); H01L 23/552 (2013.01); H05K 5/065 (2013.01);
Abstract

A shield package is disclosed including: a package in which an electronic component is mounted on a substrate, the electronic component being sealed with sealing material; and a shield layer including a first layer and a second layer that are sequentially laminated on the package, in which the first layer made from a conductive resin composition having 100 parts by mass of a binder component, 400 parts by mass to 1800 parts by mass of metal particles, and 0.3 part by mass to 40 parts by mass of a curing agent, the metal particles include at least spherical metal particles and flaky metal particles, and the second layer made from a conductive resin composition containing a binder component, metal particles haying an average particle diameter of 10 nm to 500 nm, metal particles having an average particle diameter of 1 μm to 50 μm, and a radical polymerization initiator.

Find Patent Forward Citations

Loading…