The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 2022

Filed:

Jul. 01, 2019
Applicant:

Tatsuta Electric Wire & Cable Co., Ltd., Osaka, JP;

Inventors:

Hiroaki Umeda, Kyoto, JP;

Hidetoshi Noguchi, Kyoto, JP;

Hajime Nakazono, Kyoto, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01); H01L 23/552 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0045 (2013.01); H01L 23/552 (2013.01); H05K 9/0047 (2013.01); H01L 2223/54413 (2013.01); H05K 9/0084 (2013.01);
Abstract

The present invention provides a shield package having a highly distinctive pattern formed on a surface of a shield layer. The shield package of the present invention includes a package in which an electronic component is sealed with a resin layer, and a shield layer covering the package, wherein a surface of the resin layer includes a drawing area drawn with lines and/or dots by aggregation of multiple grooves, and a non-drawing area other than the drawing area, multiple depressions originating from the grooves are formed on a surface of the shield layer on the drawing area, and the depressions are aggregated to draw a pattern with lines and/or dots.


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