Tatsuta Electric Wire & Cable Co., Ltd.

Hajime Nakazono

Hiroaki Umeda

Hidetoshi Noguchi

Kazuhiro Matsuda

Sougo Ishioka

Norihiro Yamaguchi

Masamichi Nisogi

The present invention aims to provide a shield package having a highly distinctive patterned portion formed on a surface of a shield layer. The shield package of the present invention includes a package in which an electronic component is sealed with a sealing material, and a shield layer covering the package, wherein a surface of the shield layer includes a patterned portion and a non-patterned portion other than the patterned portion, and a ratio of Sal (autocorrelation length) of the non-patterned portion to Sal of the patterned portion is as follows: (Sal of non-patterned portion)/(Sal of patterned portion)>4.0.

Shield package

The present invention provides a conductive coating material curable at low temperatures. The present invention relates to a conductive coating material containing: 100 parts by weight of an epoxy resin-containing binder component (A); 500 to 2500 parts by weight of metal particles (B); 1 to 150 parts by weight of a curing agent (C); 20 to 800 parts by weight of a solvent (D); and 0.5 to 5 parts by weight of a curing catalyst (E).

Electroconductive coating material and method for producing shielded package using said electroconductive coating material

Provided is a conductive paint that can be cured at a temperature of 110&#xb0; C. or less and has both excellent conductivity and adhesiveness. The conductive paint includes, per 100 parts by mass of a binder component (A) containing an epoxy resin, 1,000 to 4,000 parts by mass of metal particles (B), 50 to 150 parts by mass of a blocked isocyanate curing agent (C), and 200 to 1,500 parts by mass of a solvent (D).

Conductive paint, method for producing shield package using the same, and method for producing resin molded article having shield layer

The present invention provides a shield package having a highly distinctive pattern formed on a surface of a shield layer. The shield package of the present invention includes a package in which an electronic component is sealed with a resin layer, and a shield layer covering the package, wherein a surface of the resin layer includes a drawing area drawn with lines and/or dots by aggregation of multiple grooves, and a non-drawing area other than the drawing area, multiple depressions originating from the grooves are formed on a surface of the shield layer on the drawing area, and the depressions are aggregated to draw a pattern with lines and/or dots.

Shield package and method of manufacturing shield package

A shield package is disclosed including: a package in which an electronic component is mounted on a substrate, the electronic component being sealed with sealing material; and a shield layer including a first layer and a second layer that are sequentially laminated on the package, in which the first layer made from a conductive resin composition having 100 parts by mass of a binder component, 400 parts by mass to 1800 parts by mass of metal particles, and 0.3 part by mass to 40 parts by mass of a curing agent, the metal particles include at least spherical metal particles and flaky metal particles, and the second layer made from a conductive resin composition containing a binder component, metal particles haying an average particle diameter of 10 nm to 500 nm, metal particles having an average particle diameter of 1 &#x3bc;m to 50 &#x3bc;m, and a radical polymerization initiator.

A conductive paste having a viscosity suitable for filling a hole of a board, long pot life, and excellent conductivity and long-term reliability of a cured product, and a multilayer board using the same are provided. A conductive paste comprising with respect to (A) 100 parts by mass of dimer acid-modified epoxy resin, (B) from 200 to 1900 parts by mass of high melting metal powder containing silver-coated copper alloy powder and having a melting point of 800&#xb0; C. or higher, (C) from 400 to 2200 parts by mass of silver-coated copper alloy powder having a melting point of 800&#xb0; C. or higher, (D) from 1.0 to 20.0 parts by mass of curing agent containing a hydroxy group-containing aromatic compound, and (E) from 5.0 to 100.0 parts by mass of a flux containing polycarboxylic acid, is used as the present invention.

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Kizugawa, Japan

Hajime Nakazono