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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11414554 B1

PDFFull Text
Date of Patent:
Aug. 16, 2022

Filed:

Mar. 27, 2017

Conductive coating material and production method for shielded package using conductive coating material

Applicant:

Tatsuta Electric Wire & Cable Co., Ltd., Higashiosaka, JP;

Inventors:

Hiroaki Umeda, Kizugawa, JP;

Kazuhiro Matsuda, Kizugawa, JP;

Ken Yukawa, Kizugawa, JP;

Assignee:

TATSUTA ELECTRIC WIRE & CABLE CO., LTD., Higashiosaka, JP;

Attorney:

WHDA, LLP

Primary Examiner:

Tri V Nguyen

Int. Cl.
CPC ...
C09D 5/24 (2006.01); C09D 7/61 (2018.01); C09D 7/20 (2018.01); C09D 7/40 (2018.01); C09D 7/63 (2018.01); C09D 163/10 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H05K 9/00 (2006.01); C08K 3/08 (2006.01); C08K 5/13 (2006.01); C08K 9/02 (2006.01);
U.S. Cl.
CPC ...
C09D 5/24 (2013.01); C09D 7/20 (2018.01); C09D 7/61 (2018.01); C09D 7/63 (2018.01); C09D 7/70 (2018.01); C09D 163/10 (2013.01); H01L 23/293 (2013.01); H01L 23/31 (2013.01); H05K 9/0081 (2013.01); C08K 3/08 (2013.01); C08K 5/13 (2013.01); C08K 9/02 (2013.01); C08K 2003/085 (2013.01); C08K 2201/001 (2013.01); C08K 2201/003 (2013.01);
Abstract

A conductive coating material is disclosed including at least (A) 100 parts by mass of a binder component including a solid epoxy resin that is a solid at normal temperature and a liquid epoxy resin that is a liquid at normal temperature, (B) 500 to 1800 parts by mass of metal particles that have a tap density of 5.3 to 6.5 g/cmwith respect to 100 parts by mass of the binder component (A), (C) 0.3 to 40 parts by mass of a curing agent that contains at least one imidazole type curing agent with respect to 100 parts by mass of the binder component (A), and (D) 150 to 600 parts by mass of a solvent with respect to 100 parts by mass of the binder component (A).

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