The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2022
Filed:
Jun. 15, 2016
Applicant:
Tatsuta Electric Wire & Cable Co., Ltd., Higashiosaka, JP;
Inventors:
Assignee:
TATSUTA ELECTRIC WIRE & CABLE CO., LTD., Higashiosaka, JP;
Primary Examiner:
Int. Cl.
CPC ...
C08L 63/00 (2006.01); C09J 11/04 (2006.01); C09J 5/06 (2006.01); H01B 13/00 (2006.01); C09J 163/00 (2006.01); C09J 7/30 (2018.01); C09J 7/20 (2018.01); C08K 3/04 (2006.01); C08K 3/08 (2006.01); C08K 3/22 (2006.01); C08K 3/36 (2006.01);
U.S. Cl.
CPC ...
C08L 63/00 (2013.01); C08K 3/042 (2017.05); C08K 3/08 (2013.01); C08K 3/22 (2013.01); C08K 3/36 (2013.01); C09J 5/06 (2013.01); C09J 7/20 (2018.01); C09J 7/30 (2018.01); C09J 11/04 (2013.01); C09J 163/00 (2013.01); H01B 13/00 (2013.01); C08K 2003/0806 (2013.01); C08K 2003/0831 (2013.01); C08K 2003/0862 (2013.01); C08K 2003/2227 (2013.01); C09J 2301/408 (2020.08); C09J 2400/10 (2013.01); C09J 2463/00 (2013.01);
Abstract
Provided are a heat dissipation material capable of ensuring stable adhesion while reducing cost, an inlay substrate using the same, and a method for manufacturing the same. A heat dissipation material having adhesive is obtained by coating a portion or the whole of the heat dissipation material with a heat dissipation material adhering composition including a resin component containing an epoxy resin, a curing agent, and an inorganic filler, and having a complex viscosity at 80° C. of 1×10Pa·s to 5×10Pa·s.