Kanagawa, Japan

Hidetoshi Kusano

This inventor holds 22 USPTO granted patents, primarily in Semiconductor Manufacturing. Top assignees: Sony Corporation, Dai Nippon Insatsu Kabushiki Kaisha, Sony Computer Entertainment Inc.. Active years: 2000-2012.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hidetoshi Kusano. Retrieved from https://idiyas.com/inventor/hidetoshi-kusano

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 54.5

Average Co-Inventor Count = 2.2

ph-index = 9

Forward Citations = 179(Granted Patents)


Location History:

  • Oita, JP (2010 - 2011)
  • Kanagawa, JP (2000 - 2012)

Company Filing History:


Years Active: 2000-2012

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Areas of Expertise:
Semiconductor Device
Multilayer Wiring Substrate
High-Frequency Coil
Electronic Parts
Lead Frame
Manufacturing Method
Flexible Wiring Board
Cooling Efficiency
Printed Circuit Board
Semiconductor Chip
Production Method
22 patents (USPTO):Explore Patents

Title: Hidetoshi Kusano: A Pioneer in Semiconductor Innovations

Introduction

Hidetoshi Kusano, located in Kanagawa, Japan, is a prominent inventor known for his substantial contributions to semiconductor technology. With an impressive portfolio of 22 patents, Kusano has continually pushed the boundaries of innovation in his field, particularly in the manufacturing methods of semiconductor devices.

Latest Patents

Kusano's recent patents include a variety of advanced semiconductor devices and manufacturing methods. One noteworthy patent details a semiconductor device that features a substrate and a semiconductor chip with a surface facing down, mounted on the substrate. This device incorporates a reinforcement material surrounding the chip's peripheral region and a heat sink that is effectively coupled to the chip using a highly thermally conductive material. Notably, the heat sink integrates an uneven area on its side, facilitating efficient thermal management.

Another significant patent describes innovative methods for manufacturing a device-incorporated substrate and printed circuit boards. This process involves creating a transfer sheet composed of a metal base material and a dissolvee metal layer, where a conductor pattern is formed on the dissolvee layer through electroplating. Following the adhesion of this transfer sheet to an insulating base material, the separation and selective dissolution of the dissolvee metal layer occur, leading to the efficient formation of conductor patterns.

Career Highlights

Throughout his career, Hidetoshi Kusano has had the opportunity to work with notable companies, such as Sony Corporation. His experience at such prestigious firms has provided him with a solid foundation for furthering his innovation in semiconductor technology.

Collaborations

Kusano has collaborated with talented professionals in the field, including Kenji Ohsawa and Hiroshi Asami. These partnerships have undoubtedly contributed to the success and advancement of his projects, leveraging their combined expertise to enhance semiconductor solutions.

Conclusion

Hidetoshi Kusano's work in semiconductor innovations is remarkable, with a focus on efficiency and performance in manufacturing techniques. His array of 22 patents showcases his dedication to advancing technology and improving electronic devices. As he continues to innovate and inspire future generations of inventors, Kusano remains a vital figure in the field of semiconductors.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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