The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2011
Filed:
Oct. 30, 2006
Tomoshi Ohde, Kanagawa, JP;
Fujio Kanayama, Oita, JP;
Mitsuru Adachi, Kanagawa, JP;
Tetsunori Niimi, Kanagawa, JP;
Hidetoshi Kusano, Oita, JP;
Yuji Nishitani, Kanagawa, JP;
Tomoshi Ohde, Kanagawa, JP;
Fujio Kanayama, Oita, JP;
Mitsuru Adachi, Kanagawa, JP;
Tetsunori Niimi, Kanagawa, JP;
Hidetoshi Kusano, Oita, JP;
Yuji Nishitani, Kanagawa, JP;
Sony Corporation, Tokyo, JP;
Sony Computer Entertainment Inc., Tokyo, JP;
Abstract
A semiconductor device is provided in which the heat dissipation characteristic of a flip-chip mounted semiconductor chip is improved. A semiconductor device is provided with a substrate, a semiconductor flip-chip mounted on the substrate, a sealing resin layer for sealing around the semiconductor flip-chip. A sealing resin layer for sealing the semiconductor chip is formed around the semiconductor chip. In this semiconductor device, the back surface of the semiconductor chip is exposed and is convex with respect to the upper surface of the sealing resin layer.