The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 16, 2010
Filed:
May. 22, 2007
Applicants:
Hidetoshi Kusano, Oita, JP;
Kazuaki Yazawa, Chiba, JP;
Inventors:
Hidetoshi Kusano, Oita, JP;
Kazuaki Yazawa, Chiba, JP;
Assignee:
Sony Computer Entertainment Inc., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor device includes a substrate, a semiconductor chip flip-chip mounted on the substrate, a sealing resin layer sealing the surroundings of the semiconductor chip, and a heat sink bonded to the sealing resin layer through a TIM layer. In addition, a cooling medium is encapsulated in an enclosed space formed on the rear surface of the semiconductor chip.