Sony Corporation

Other

Sony Computer Entertainment Inc.

Dai Nippon Insatsu Kabushiki Kaisha

Hidetoshi Kusano

Kenji Ohsawa

Hiroshi Asami

Ken Orui

Yuji Nishitani

Haruhiko Makino

Tomoo Iijima

Hideyuki Takahashi

Kenji Oosawa

Shinji Kumon

Kazuaki Yazawa

Tomoshi Ohde

Sakan Iwashita

Mitsuru Adachi

Fujio Kanayama

Fumito Hiwatashi

Tetsunori Niimi

Yuki Nishitani

A semiconductor device includes: a substrate; a semiconductor chip with a surface facing down mounted on the substrate; a reinforcement material provided on the substrate in a peripheral region of a region on which the semiconductor chip is mounted; and a heat sink coupled to the semiconductor chip via a highly thermally conductive material. The heat sink is disposed on the semiconductor chip and the reinforcement material by being coupled to the reinforcement material via an adhesive material, and is provided with an uneven area on a side coupled to the reinforcement material.

Semiconductor device and method of manufacturing the same

A method of manufacturing a device-incorporated substrate as well as a printed circuit board. A transfer sheet is formed having a structure that includes two layers, a metal base material and a dissolvee metal layer and a conductor pattern is formed on the dissolvee metal layer by electroplating. After the transfer sheet on which the conductor pattern is formed is adhered onto an insulating base material, the transfer sheet is removed by separating the metal base material from the dissolvee metal layer and thereafter selectively dissolving and removing the dissolvee metal layer with respect to the conductor pattern.

Method of manufacturing a device incorporated substrate and method of manufacturing a printed circuit board

A semiconductor device is provided in which the heat dissipation characteristic of a flip-chip mounted semiconductor chip is improved. A semiconductor device is provided with a substrate, a semiconductor flip-chip mounted on the substrate, a sealing resin layer for sealing around the semiconductor flip-chip. A sealing resin layer for sealing the semiconductor chip is formed around the semiconductor chip. In this semiconductor device, the back surface of the semiconductor chip is exposed and is convex with respect to the upper surface of the sealing resin layer.

Semiconductor device and method of manufacturing semiconductor device

A semiconductor device includes a substrate, a semiconductor chip flip-chip mounted on the substrate, a sealing resin layer sealing the surroundings of the semiconductor chip, and a heat sink bonded to the sealing resin layer through a TIM layer. In addition, a cooling medium is encapsulated in an enclosed space formed on the rear surface of the semiconductor chip.

Semiconductor device having high cooling efficiency and method for manufacturing the same

The present invention provides a method of manufacturing a multilayer wiring substrate, which can preserve the dimensional stability of a conductor pattern at a fine pitch, solve the restriction on a process from the viewpoint of material selection, and further reduce a manufacturing cost, and a multilayer wiring substrate. A second wiring substrate formed on a supporting sheet made of metal and an adhesive layer are partially stacked on a predetermined region of a first wiring substrate by using the supporting sheet. After the lamination of the second wiring substrate, the supporting sheet is finally etched and removed. The second wiring substrate is stacked only on the portion required to be multilayered on the first wiring substrate to thereby reduce the amount of the construction material of the second wiring substrate.

Method of manufacturing multilayer wiring substrate using temporary metal support layer

Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate

A method of manufacturing a multilayer wiring substrate, which can preserve the dimensional stability of a conductor pattern at a fine pitch, solve the restriction on a process from the viewpoint of material selection, and further reduce a manufacturing cost, and a multilayer wiring substrate. A second wiring substrate formed on a supporting sheet made of metal and an adhesive layer are partially stacked on a predetermined region of a first wiring substrate by using the supporting sheet. After the lamination of the second wiring substrate, the supporting sheet is finally etched and removed. The second wiling substrate is stacked only on the portion required to be multilayered on the first wiring substrate to thereby reduce the amount of the construction material of the second wiring substrate.

In a high-frequency coil device having small dispersion in coil inductance and suitable for use in GHz band and a method of manufacturing the high-frequency coil device, a spirally-shaped fine-pitch coil is embedded in the surface of a polyimide layer as a dielectric substrate so that the bottom surface and side surface of the coil is covered by the polyimide layer. The spirally-shaped coil has an Ni&#x2014;Cu laminate structure in which an Ni plating layer and a Cu plating layer are laminated, and also the side surface thereof is made substantially vertical while the width thereof is uniform with high precision. The surface of the spirally-shaped coil, that is, the surface of the Ni plating layer serving as the upper layer is coated with an Au plating layer.

Method of manufacturing a high-frequency coil device

A flexible multilayer wiring board manufactured by laminating a metal foil via an insulating layer to cover the first layer circuit wiring formed on a conductive substrate, and a resist layer is formed to cover the second layer circuit wiring formed by pattern-etching the metal foil. Using the conductive substrate as a power feeding layer, a conductive material is filled, by electrolytic plating, into interlayer via holes each formed applying a laser beam to the resist layer to establish interlayer connection between the first and second layer circuit wirings. Using the conductive substrate as a power feeding layer, a conductive material is filled, by electrolytic plating, into hole portions of an insulating layer formed to cover the second layer circuit wiring to form external connection terminals. Then, the conductive substrate is removed entirely or partly to expose the first layer circuit wiring.

Manufacture method of a flexible multilayer wiring board

Metal foil is laminated via an insulating layer so as to cover the first layer circuit wiring formed on a conductive substrate, and a resist layer is formed so as to cover the second layer circuit wiring formed by pattern-etching the metal foil. Using the conductive substrate as a power feeding layer, a conductive material is filled, by electrolytic plating, in interlayer via holes each formed by applying a laser beam to the resist layer, thereby to establish interlayer connection between the first layer circuit wiring and the second layer circuit wiring. Subsequently, the resist layer is removed, and then, using the conductive substrate as a power feeding layer, a conductive material is filled, by electrolytic plating, in hole portions of an insulating layer formed so as to cover the second layer circuit wiring, thereby to form external connection terminals. Then, the conductive substrate is removed entirely or partly to expose the first layer circuit wiring, thereby to manufacture a flexible multilayer wiring board.

Flexible multilayer wiring board and manufacture method thereof

High-frequency coil device and method of manufacturing the same

An electronic parts mounting board includes an electrode circuit base member having electrodes on at least one surface; projecting electrodes bonded to the electrodes of the electrode circuit base member; an insulating member provided on the electrode circuit base member in such a manner as to insulate the electrodes of the electrode circuit base member and the projecting electrodes; and circuit electrode patterns provided on the insulating member and the projecting electrodes. In this mounting board, the projecting electrodes are formed by forming specific projecting conductive members at specific positions of the circuit electrode patterns by plating, and pressing the projecting conductive members in the insulating member so as to pass through the insulating member and reach the electrodes of the electrode circuit base member. The mounting board is capable of connecting circuit electrode patterns to a specific electrode base member via small contacts comparable to those obtained by a photo via process at a high positional accuracy, and improving the flatness and adhesive force of the circuit electrode patterns, without use of an expensive laser system for drilling.

Electronic parts mounting board and production method thereof

By adopting an electrolytic plating method in forming the bump, the drawbacks of the conventional electrolytic plating method should be avoided. For example, the necessity of adopting a lead wiring for each wiring or the like should be eliminated. On the surface of a metal base, a resist film (first resist film) having a negative pattern for forming a wiring film and a resist film (second resist film) having a negative pattern for forming the bump or the pad is formed. By using these films as masks, electrolytic plating of a bump material film is conducted to form the bump. Subsequently, after only the second film is removed. By using the first resist film as a mask, electrolytic plating is then conducted to form a wiring film.

Fabrication method of wiring substrate for mounting semiconductor element and semiconductor device

Metal films (for instance, gold films or palladium films) to constitute bumps are formed on a metal base by electrolytic plating. Then, a circuit wiring including inner leads is formed by electrolytic plating with a metal so that the inner leads are connected to the respective metal films.

Lead frame, manufacturing method of a lead frame, semiconductor device, assembling method of a semiconductor device, and electronic apparatus

A lead frame comprises: outer leads formed by a metal base member; first interconnection film portions formed by a metal plating layer, each of which is disposed inside the outer leads in such a manner as to be connected to an inner end of one principal plane of the corresponding one of the outer leads, and at least one second interconnection film portion formed by the metal plating layer, which is disposed inside the outer leads in such a manner as not to be connected to the outer leads; and an insulating film formed to cover planes, opposed to the outer leads, of the first and second interconnection film portions, thereby holding the first and second interconnection film portions; wherein planes, opposed to the insulating film, of the first and second interconnection film portions are taken as semiconductor element mounting planes. With this configuration, the lead frame allows a plurality of semiconductor elements to be mounted on one semiconductor device without increasing the number of assembling steps, while making the thickness of the semiconductor device thin, and reducing the reliability and the production yield.

Growing community of inventors

Kanagawa, Japan

Hidetoshi Kusano