The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 13, 2003
Filed:
Jan. 26, 2000
Applicant:
Inventors:
Kenji Ohsawa, Kanagawa, JP;
Hidetoshi Kusano, Kanagawa, JP;
Haruhiko Makino, Kanagawa, JP;
Hideyuki Takahashi, Kanagawa, JP;
Assignee:
Sony Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/3495 ; H01L 2/348 ; H01L 2/352 ; H01L 2/940 ; H01L 2/144 ;
U.S. Cl.
CPC ...
H01L 2/3495 ; H01L 2/348 ; H01L 2/352 ; H01L 2/940 ; H01L 2/144 ;
Abstract
Metal films (for instance, gold films or palladium films) to constitute bumps are formed on a metal base by electrolytic plating. Then, a circuit wiring including inner leads is formed by electrolytic plating with a metal so that the inner leads are connected to the respective metal films.