The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 03, 2012
Filed:
May. 04, 2009
Hiroshi Asami, Shizuoka, JP;
Ken Orui, Kanagawa, JP;
Hidetoshi Kusano, Kanagawa, JP;
Fumito Hiwatashi, Tokyo, JP;
Hiroshi Asami, Shizuoka, JP;
Ken Orui, Kanagawa, JP;
Hidetoshi Kusano, Kanagawa, JP;
Fumito Hiwatashi, Tokyo, JP;
Sony Corporation, Tokyo, JP;
Abstract
A method of manufacturing a device-incorporated substrate as well as a printed circuit board. A transfer sheet is formed having a structure that includes two layers, a metal base material and a dissolvee metal layer and a conductor pattern is formed on the dissolvee metal layer by electroplating. After the transfer sheet on which the conductor pattern is formed is adhered onto an insulating base material, the transfer sheet is removed by separating the metal base material from the dissolvee metal layer and thereafter selectively dissolving and removing the dissolvee metal layer with respect to the conductor pattern.