Company Filing History:
Years Active: 2011-2012
Title: Fumito Hiwatashi: Innovator in Device-Incorporated Substrates
Introduction
Fumito Hiwatashi is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of electronics, particularly in the manufacturing of device-incorporated substrates and printed circuit boards. With a total of 2 patents, Hiwatashi's work is recognized for its precision and innovation.
Latest Patents
His latest patents include a method of manufacturing a device-incorporated substrate and a method of manufacturing a printed circuit board. The first patent describes a process where a transfer sheet is created with a structure that includes two layers: a metal base material and a dissolvee metal layer. A conductor pattern is formed on the dissolvee metal layer through electroplating. After adhering the transfer sheet onto an insulating base material, the metal base material is separated from the dissolvee metal layer, which is then selectively dissolved and removed with respect to the conductor pattern. The second patent focuses on the same principles, emphasizing the ability to form a fine-pitch conductor pattern on an insulating layer with high precision while maintaining dimensional stability.
Career Highlights
Fumito Hiwatashi is currently employed at Sony Corporation, where he continues to innovate and develop new technologies. His work has been instrumental in advancing the capabilities of electronic devices, making them more efficient and reliable.
Collaborations
He collaborates with talented individuals such as Asami Hiroshi and Orui Ken, contributing to a dynamic and innovative work environment.
Conclusion
Fumito Hiwatashi's contributions to the field of electronics through his patents and work at Sony Corporation highlight his role as a key innovator. His methods for manufacturing device-incorporated substrates and printed circuit boards are paving the way for future advancements in technology.