Sony Corporation

Fumito Hiwatashi

Hiroshi Asami

Hidetoshi Kusano

Ken Orui

Asami Hiroshi

Orui Ken

Kusano Hidetoshi

A method of manufacturing a device-incorporated substrate as well as a printed circuit board. A transfer sheet is formed having a structure that includes two layers, a metal base material and a dissolvee metal layer and a conductor pattern is formed on the dissolvee metal layer by electroplating. After the transfer sheet on which the conductor pattern is formed is adhered onto an insulating base material, the transfer sheet is removed by separating the metal base material from the dissolvee metal layer and thereafter selectively dissolving and removing the dissolvee metal layer with respect to the conductor pattern.

Method of manufacturing a device incorporated substrate and method of manufacturing a printed circuit board

A device-incorporated substrate and a method of manufacturing a device-incorporated substrate, as well as a printed circuit board and a method of manufacturing a printed circuit board in which a fine-pitch conductor pattern can be formed on an insulating layer with high precision while securing the dimensional stability of the conductor pattern, are provided. A transfer sheet () has a structure that includes two layers, a metal base material () and a dissolvee metal layer (), and a conductor pattern () is formed on the dissolvee metal layer () through electroplating. Then, after the transfer sheet () on which the conductor pattern () is formed is adhered onto an insulating base material (), the transfer sheet () is removed through a step of separating the metal base material () from the dissolvee metal layer (), and a step of selectively dissolving and removing the dissolvee metal layer () with respect to the conductor pattern ().

Method of manufacturing a device-incorporated substrate

Growing community of inventors

Tokyo, Japan

Fumito Hiwatashi