IDiyas

For the Inventor, By the Inventor

Seongnam-si, South Korea

Heung Kyu Kwon

USPTO Granted Patents = 14

Average Co-Inventor Count = 1.5

ph-index = 6

Forward Citations = 308(Granted Patents)


Location History:

  • Bucheon, KR (1993)
  • Kyungki-do, KR (2001 - 2005)
  • Sungnam, KR (2006)
  • Seongnam, KR (2003 - 2007)
  • Seongnam-Si, KR (2009 - 2018)

Company Filing History:

goldMedal14 out of 131,214 
 
Samsung Electronics Co., Ltd.
 patents

Years Active: 1993-2018

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14 patents (USPTO):Explore Patents
1. 10025354 - System module and mobile computing device including the same (2018-07-17),
2. 9984032 - System on package (SoP) having through silicon via (TSV) interposer with memory controller connected to multiple printed circuit boards (PCB) (2018-05-29),
3. 9839127 - System of package (SoP) module and mobile computing device having the SoP (2017-12-05),
4. 9811122 - Package on packages and mobile computing devices having the same (2017-11-07),
5. 9665122 - Semiconductor device having markings and package on package including the same (2017-05-30),
6. 9640499 - Semiconductor chip, flip chip package and wafer level package including the same (2017-05-02),
7. 7566954 - Bonding configurations for lead-frame-based and substrate-based semiconductor packages (2009-07-28),
8. 7211469 - Semiconductor wafer having electrically connected passive device chips, passive devices and semiconductor package using the same (2007-05-01),
9. 7005320 - Method for manufacturing flip chip package devices with a heat spreader (2006-02-28),
10. 6943430 - Semiconductor wafer having electrically connected passive device chips, passive devices and semiconductor package using the same (2005-09-13),
11. 6903451 - Chip scale packages manufactured at wafer level (2005-06-07),
12. 6518660 - Semiconductor package with ground projections (2003-02-11),
13. 6187615 - Chip scale packages and methods for manufacturing the chip scale packages at wafer level (2001-02-13),
14. 5250840 - Semiconductor lead frame with a chip having bonding pads in a cross (1993-10-05),
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