Heung Kyu Kwon

This inventor holds 14 USPTO granted patents, primarily in Semiconductor Packaging. Top assignee: Samsung Electronics Co., Ltd.. Active years: 1993-2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Heung Kyu Kwon. Retrieved from https://idiyas.com/inventor/heung-kyu-kwon-wenqcd1r

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 14

% Patents Active = 100.0

Average Co-Inventor Count = 1.5

ph-index = 6

Forward Citations = 316(Granted Patents)

Location History:

Bucheon, KR (1993)
Kyungki-do, KR (2001 - 2005)
Sungnam, KR (2006)
Seongnam, KR (2003 - 2007)
Seongnam-Si, KR (2009 - 2018)

Company Filing History:

14 out of 138,671

Samsung Electronics Co., Ltd.

patents

Years Active: 1993-2018

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Areas of Expertise:

Semiconductor Packaging

System on Package

Through Silicon Via

Mobile Computing Device

Chip Scale Packages

Wafer Level Package

Bonding Configurations

Passive Device Chips

Thermal Management

Lead Frame

Memory Controller

Printed Circuit Boards

14 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10025354 - System module and mobile computing device including the same (2018-07-17),

2. 9984032 - System on package (SoP) having through silicon via (TSV) interposer with memory controller connected to multiple printed circuit boards (PCB) (2018-05-29),

3. 9839127 - System of package (SoP) module and mobile computing device having the SoP (2017-12-05),

4. 9811122 - Package on packages and mobile computing devices having the same (2017-11-07),

5. 9665122 - Semiconductor device having markings and package on package including the same (2017-05-30),

6. 9640499 - Semiconductor chip, flip chip package and wafer level package including the same (2017-05-02),

7. 7566954 - Bonding configurations for lead-frame-based and substrate-based semiconductor packages (2009-07-28),

8. 7211469 - Semiconductor wafer having electrically connected passive device chips, passive devices and semiconductor package using the same (2007-05-01),

9. 7005320 - Method for manufacturing flip chip package devices with a heat spreader (2006-02-28),

10. 6943430 - Semiconductor wafer having electrically connected passive device chips, passive devices and semiconductor package using the same (2005-09-13),

11. 6903451 - Chip scale packages manufactured at wafer level (2005-06-07),

12. 6518660 - Semiconductor package with ground projections (2003-02-11),

13. 6187615 - Chip scale packages and methods for manufacturing the chip scale packages at wafer level (2001-02-13),

14. 5250840 - Semiconductor lead frame with a chip having bonding pads in a cross (1993-10-05),

Title: Heung Kyu Kwon: Innovator in Mobile Computing Technology

Introduction

Heung Kyu Kwon is a prominent inventor based in Seongnam, South Korea. He has made significant contributions to the field of mobile computing, holding a total of 14 patents. His work primarily focuses on advanced system modules and packaging technologies that enhance the performance and efficiency of electronic devices.

Latest Patents

Among his latest patents, Kwon has developed a system module and a mobile computing device that includes a printed circuit board (PCB) with a first semiconductor chip embedded within it. This innovative design features a semiconductor package connected to the PCB through multiple stack balls, along with a second semiconductor chip positioned on the PCB's surface. Another notable patent is for a system on package (SoP) that utilizes a through silicon via (TSV) interposer with a memory controller linked to multiple PCBs. This system comprises stacked packages that are electrically connected, enhancing the integration of memory devices and controllers.

Career Highlights

Heung Kyu Kwon is currently employed at Samsung Electronics Co., Ltd., where he continues to push the boundaries of mobile technology. His work has been instrumental in developing cutting-edge solutions that cater to the growing demands of the electronics market. Kwon's innovative spirit and technical expertise have positioned him as a key player in the industry.

Collaborations

Throughout his career, Kwon has collaborated with notable colleagues, including Dong Hyeon Jang and Nam Seog Kim. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Heung Kyu Kwon's contributions to mobile computing technology are noteworthy and impactful. His innovative patents and collaborations reflect his dedication to advancing the field. Kwon's work continues to shape the future of electronic devices, making him a significant figure in the world of inventions.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]