logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9839127 B1

PDFFull Text
Date of Patent:
Dec. 05, 2017

Filed:

Jul. 07, 2015

System of package (sop) module and mobile computing device having the sop

Applicants:

Heung Kyu Kwon, Seongnam-si, KR;

Kyoung Mook Lim, Hwaseong-si, KR;

Inventors:

Heung Kyu Kwon, Seongnam-si, KR;

Kyoung Mook Lim, Hwaseong-si, KR;

Assignee:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Attorney:

Volentine & Whitt, PLLC

Primary Examiner:

Hoa C Nguyen

Assistant Examiner:

Stanley Tso

Int. Cl.
CPC ...
H05K 1/18 (2006.01); G01R 31/28 (2006.01); G06F 1/16 (2006.01); H01L 23/552 (2006.01); H01L 25/065 (2006.01); H01L 23/31 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); G01R 31/2884 (2013.01); G06F 1/1613 (2013.01); G06F 1/1637 (2013.01); H01L 23/552 (2013.01); H01L 25/065 (2013.01); H05K 1/0268 (2013.01); H01L 23/3121 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06596 (2013.01); H01L 2924/15174 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15313 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/19106 (2013.01); H01L 2924/3025 (2013.01); H05K 1/0215 (2013.01); H05K 1/112 (2013.01); H05K 2201/10159 (2013.01); H05K 2201/10371 (2013.01); H05K 2201/10515 (2013.01); H05K 2201/10545 (2013.01); H05K 2201/10674 (2013.01); Y02P 70/611 (2015.11);
Abstract

A system on package SoP module includes a printed circuit board (PCB) having a first side and an opposing second side, a first IC attached to the first side, a second IC attached to the second side. The PCB also provides electrical paths for connecting the first IC and the second IC. Conductors by which the second IC is attached to the PCB also allow for electrical testing of the first IC when the SoP is in a system level state.

Find Patent Forward Citations

Quick Actions:

Kwon, Heung. (2017). System of package (sop) module and mobile computing device having the sop (U.S. Patent No. 9839127). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9839127

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…