logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9811122 B1

PDFFull Text
Date of Patent:
Nov. 07, 2017

Filed:

Dec. 01, 2015

Package on packages and mobile computing devices having the same

Applicant:

Heung Kyu Kwon, Seongnam-Si, KR;

Inventor:

Heung Kyu Kwon, Seongnam-Si, KR;

Assignee:

Samsung Electronics Co., Ltd., Gyeonggi-Do, KR;

Attorney:

Harness, Dickey & Pierce, P.L.C.

Primary Examiner:

S V Clark

Int. Cl.
CPC ...
H01L 23/02 (2006.01); G06F 1/16 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 25/10 (2006.01); H01L 25/065 (2006.01); H01L 23/31 (2006.01); H01L 25/18 (2006.01);
U.S. Cl.
CPC ...
G06F 1/1658 (2013.01); H01L 23/48 (2013.01); H01L 23/49811 (2013.01); H01L 23/5383 (2013.01); H01L 25/0655 (2013.01); H01L 25/0657 (2013.01); H01L 25/105 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 25/18 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48235 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/92125 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06558 (2013.01); H01L 2225/06562 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/1436 (2013.01); H01L 2924/1437 (2013.01); H01L 2924/1438 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15331 (2013.01);
Abstract

A package on package may include: a first printed circuit board (PCB); a bottom package which includes a first chip die and a second chip die attached to the first PCB; a top package which includes a second PCB and a third chip die attached to the second PCB, and is overlaid over the bottom package; and/or first stack connection solder balls and second stack connection solder balls which are electrically connected between the first PCB and the second PCB, and are formed only around two sides facing each other among sides of the bottom package.

Find Patent Forward Citations

Quick Actions:

Kwon, Heung. (2017). Package on packages and mobile computing devices having the same (U.S. Patent No. 9811122). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9811122

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…