The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2009
Filed:
Mar. 18, 2005
Applicants:
Kyung Lae Jang, Seongnam-Si, KR;
Hee Seok Lee, Hwasung-Si, KR;
Heung Kyu Kwon, Seongnam-Si, KR;
Inventors:
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
Abstract
In a bonding configuration for a semiconductor device package, the bonding angles of the bonding wires are maintained within acceptable limits, without causing an increase in the chip die size, and without necessitating the use of the corner rule. In this manner, the occurrence of shorting between adjacent bonding wires can be mitigated or eliminated, and device net die count during fabrication can be increased.