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For the Inventor, By the Inventor

Cheonan-si, South Korea

Heui-seog Kim

USPTO Granted Patents = 14

Average Co-Inventor Count = 3.9

ph-index = 4

Forward Citations = 48(Granted Patents)


Location History:

  • Cheonan, KR (2004)
  • Cheonan-si, KR (2008 - 2011)
  • Asan-si, KR (2013 - 2015)

Company Filing History:

goldMedal14 out of 131,214 
 
Samsung Electronics Co., Ltd.
 patents

Years Active: 2004-2015

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14 patents (USPTO):Explore Patents
1. 9184065 - Method of molding semiconductor package (2015-11-10),
2. 8956921 - Method of molding semiconductor package (2015-02-17),
3. 8466074 - Method for processing a substrate using a laser beam (2013-06-18),
4. 8420450 - Method of molding semiconductor package (2013-04-16),
5. 8039972 - Printed circuit board and method thereof and a solder ball land and method thereof (2011-10-18),
6. 7906423 - Semiconductor device and method of manufacturing the same (2011-03-15),
7. 7791178 - Lead frame unit, semiconductor package having a lead frame unit, stacked semiconductor package having a semiconductor package and methods of manufacturing the same (2010-09-07),
8. 7745932 - Semiconductor package, semiconductor package module including the semiconductor package, and methods of fabricating the same (2010-06-29),
9. 7663219 - Semiconductor device and method of manufacturing the same (2010-02-16),
10. 7576438 - Printed circuit board and method thereof and a solder ball land and method thereof (2009-08-18),
11. 7427558 - Method of forming solder ball, and fabricating method and structure of semiconductor package using the same (2008-09-23),
12. 7420814 - Package stack and manufacturing method thereof (2008-09-02),
13. 6787393 - Semiconductor package including a double-faced semiconductor chip having integrated circuitry on both sides thereof and a method of fabricating the semiconductor package (2004-09-07),
14. 6780734 - Wafer table and semiconductor package manufacturing apparatus using the same (2004-08-24),

Title: Heui-seog Kim: Innovator in Semiconductor Packaging

Introduction

Heui-seog Kim is a prominent inventor based in Cheonan-si, South Korea. He has made significant contributions to the field of semiconductor packaging, holding a total of 14 patents. His innovative methods have advanced the technology used in semiconductor manufacturing.

Latest Patents

One of Heui-seog Kim's latest patents is a method of molding semiconductor packages. This method involves coating liquid molding resin or disposing of solid molding resin on the top surface of a semiconductor chip arranged on a substrate. The solid molding resin may include powdered molding resin or sheet-type molding resin. In cases where liquid molding resin is coated on the semiconductor chip, the substrate is mounted between a lower molding and an upper molding, and melted molding resin is filled in the space between them. Alternatively, when solid molding resin is used, it is heated and melts into liquid molding resin, which is then filled in the space between the lower and upper moldings.

Career Highlights

Heui-seog Kim is currently employed at Samsung Electronics Co., Ltd., where he continues to develop innovative solutions in semiconductor technology. His work has been instrumental in enhancing the efficiency and reliability of semiconductor packages.

Collaborations

Heui-seog Kim has collaborated with notable colleagues, including Jun-Young Ko and Wha-su Sin. These partnerships have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Heui-seog Kim's contributions to semiconductor packaging exemplify the spirit of innovation in the technology sector. His patents and collaborative efforts continue to shape the future of semiconductor manufacturing.

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