The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 16, 2010

Filed:

Oct. 29, 2007
Applicants:

Hyo-jae Bang, Cheonan-si, KR;

Heui-seog Kim, Cheonan-si, KR;

Dong-chun Lee, Cheonan-si, KR;

Seong-chan Han, Cheonan-si, KR;

Jung-hyeon Kim, Hwaseong-si, KR;

Inventors:

Hyo-Jae Bang, Cheonan-si, KR;

Heui-Seog Kim, Cheonan-si, KR;

Dong-Chun Lee, Cheonan-si, KR;

Seong-Chan Han, Cheonan-si, KR;

Jung-Hyeon Kim, Hwaseong-si, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device includes a semiconductor package, a circuit board and an interval maintaining member. The semiconductor package has a body and a lead protruded from the body. The circuit board has a first land electrically connected to the lead. The interval maintaining member is interposed between the circuit board and the body. The interval maintaining member maintains an interval between the lead and the first land. Thus, an interval between the lead and the land is uniformly maintained, so that a thermal and/or mechanical reliability of the semiconductor device is improved.


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