The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 23, 2008
Filed:
Mar. 03, 2005
Applicants:
Jae-hong Kim, Cheonan-si, KR;
Heui-seog Kim, Cheonan-si, KR;
Wha-su Sin, Cheonan-si, KR;
Jong-keun Jeon, Cheonan-si, KR;
Inventors:
Jae-Hong Kim, Cheonan-si, KR;
Heui-Seog Kim, Cheonan-si, KR;
Wha-Su Sin, Cheonan-si, KR;
Jong-Keun Jeon, Cheonan-si, KR;
Assignee:
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of forming solder balls may involve forming bumps through wire boding on land patterns of a circuit substrate. Solder cream may be applied to the bumps through screen printing. The solder cream may be melted via reflow to form solder balls in which the bumps are embedded.