The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 18, 2009

Filed:

Jul. 14, 2006
Applicants:

Ky-hyun Jung, Cheonan-si, KR;

Heui-seog Kim, Cheonan-si, KR;

Sang-jun Kim, Cheonan-si, KR;

Wha-su Sin, Cheonan-si, KR;

Ho-geon Song, Cheonan-si, KR;

Jun-young Ko, Cheonan-si, KR;

Inventors:

Ky-hyun Jung, Cheonan-si, KR;

Heui-seog Kim, Cheonan-si, KR;

Sang-jun Kim, Cheonan-si, KR;

Wha-su Sin, Cheonan-si, KR;

Ho-geon Song, Cheonan-si, KR;

Jun-young Ko, Cheonan-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract

A printed circuit board and method thereof and a solder ball land and method thereof. The example printed circuit board (PCB) may include a first solder ball land having a first surface treatment portion configured for a first type of resistance and a second solder ball land having a second surface treatment portion configured for a second type of resistance. The example solder ball land may include a first surface treatment portion configured for a first type of resistance and a second surface treatment portion configured for a second type of resistance. A first example method may include first treating a first surface of a first solder ball land to increase a first type of resistance and second treating a second surface of a second solder ball land to increase a second type of resistance other than the first type of resistance. A second example method may include first treating a solder ball land to increase a first type of resistance and second treating the solder ball land to increase a second type of resistance other than the first type of resistance.


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