Cheonan-si, South Korea

Sang-jun Kim

USPTO Granted Patents = 3 

Average Co-Inventor Count = 4.5

ph-index = 2

Forward Citations = 11(Granted Patents)


Company Filing History:


Years Active: 2009-2011

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3 patents (USPTO):Explore Patents

Title: Sang-jun Kim: Innovator in Printed Circuit Board Technology

Introduction

Sang-jun Kim is a notable inventor based in Cheonan-si, South Korea. He has made significant contributions to the field of electronics, particularly in the development of printed circuit boards (PCBs) and related technologies. With a total of 3 patents to his name, Kim continues to push the boundaries of innovation in his field.

Latest Patents

Sang-jun Kim's latest patents include advancements in printed circuit board technology and methods for enhancing solder ball lands. One of his notable inventions is a printed circuit board that features a first solder ball land with a specific surface treatment for a designated type of resistance, alongside a second solder ball land with a different surface treatment. This innovation allows for improved performance and reliability in electronic devices. Additionally, he has developed a wafer grinding and tape attaching apparatus and method, which streamlines the process of preparing wafers for further manufacturing steps.

Career Highlights

Kim is currently employed at Samsung Electronics Co., Ltd., a leading global technology company. His work at Samsung has allowed him to collaborate with some of the brightest minds in the industry, contributing to the company's reputation for innovation and quality in electronic products.

Collaborations

Throughout his career, Sang-jun Kim has worked alongside talented colleagues, including Jun-Young Ko and Ky-Hyun Jung. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.

Conclusion

Sang-jun Kim is a prominent figure in the realm of electronic innovations, particularly in printed circuit board technology. His contributions through patents and collaborations highlight his commitment to advancing the field and improving electronic device performance.

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