The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 07, 2004
Filed:
Feb. 24, 2003
Ho-tae Jin, Cheonan, KR;
Heui-seog Kim, Cheonan, KR;
Samsung Electronics Co., Ltd., Kyungki-do, KR;
Abstract
A semiconductor package including a double-faced semiconductor chip having integrated circuitry on both sides thereof, and a method of fabricating the same is provided, wherein the semiconductor package includes the semiconductor chip; a lead-on-chip (LOC)-type substrate, having metal patterns on both sides, bonded with the first side of the semiconductor chip; first wires for connecting the first side of the semiconductor chip to the second side of the LOC-type substrate; second wires for connecting the second side of the semiconductor chip to the first side of the LOC-type substrate; a first sealing material for covering the semiconductor chip, the first wires, and the second side of the LOC-type substrate; a second sealing material for covering the semiconductor chip, the second wires, and the first side of the LOC-type substrate; and solder balls attached to the second side of the LOC-type substrate.